Part Details for LD27C513-200V10 by Intel Corporation
Overview of LD27C513-200V10 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for LD27C513-200V10
LD27C513-200V10 CAD Models
LD27C513-200V10 Part Data Attributes:
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LD27C513-200V10
Intel Corporation
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Datasheet
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LD27C513-200V10
Intel Corporation
UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP28,.6 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.15 mm | |
| Memory Density | 524288 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.72 mm | |
| Standby Current-Max | 0.001 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for LD27C513-200V10
This table gives cross-reference parts and alternative options found for LD27C513-200V10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LD27C513-200V10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TD27C513-200V10 | UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 | Intel Corporation | LD27C513-200V10 vs TD27C513-200V10 |
| QD27513-2 | UVPROM, 64KX8, 200ns, NMOS, CDIP28, CERDIP-28 | Intel Corporation | LD27C513-200V10 vs QD27513-2 |
| M27C512-20F6E | 64KX8 UVPROM, 200ns, CDIP28, ROHS COMPLIANT, CERAMIC, DIP-28 | STMicroelectronics | LD27C513-200V10 vs M27C512-20F6E |
| NM27C512QE200 | UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | Fairchild Semiconductor Corporation | LD27C513-200V10 vs NM27C512QE200 |
| TMM27512AD-20 | IC 64K X 8 UVPROM, 200 ns, CDIP28, CERDIP-28, Programmable ROM | Toshiba America Electronic Components | LD27C513-200V10 vs TMM27512AD-20 |
| TMS27C512-2JL | 524 288-Bit Programmable Read-Only Memory 28-CDIP 0 to 70 | Texas Instruments | LD27C513-200V10 vs TMS27C512-2JL |
| AM27C512-200DCB | UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Spansion | LD27C513-200V10 vs AM27C512-200DCB |
| QD27513-200V10 | UVPROM, 64KX8, 200ns, NMOS, CDIP28, CERDIP-28 | Intel Corporation | LD27C513-200V10 vs QD27513-200V10 |
| AM27C512-200DIB | UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Spansion | LD27C513-200V10 vs AM27C512-200DIB |
| MBM27C512-20WZ | 64KX8 UVPROM, 200ns, CDIP28, CERDIP-28 | FUJITSU Limited | LD27C513-200V10 vs MBM27C512-20WZ |