Datasheets
QD27513-200V10 by: Intel Corporation

UVPROM, 64KX8, 200ns, NMOS, CDIP28, CERDIP-28

Part Details for QD27513-200V10 by Intel Corporation

Overview of QD27513-200V10 by Intel Corporation

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Part Details for QD27513-200V10

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QD27513-200V10 Part Data Attributes

QD27513-200V10 Intel Corporation
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QD27513-200V10 Intel Corporation UVPROM, 64KX8, 200ns, NMOS, CDIP28, CERDIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Part Package Code DIP
Package Description WDIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Length 37.15 mm
Memory Density 524288 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.72 mm
Supply Current-Max 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for QD27513-200V10

This table gives cross-reference parts and alternative options found for QD27513-200V10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QD27513-200V10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27C512-200DC UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion QD27513-200V10 vs AM27C512-200DC
M27C512-20F3 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 STMicroelectronics QD27513-200V10 vs M27C512-20F3
AM27C512L-200DE UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD QD27513-200V10 vs AM27C512L-200DE
NMC27C512AQ200 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments QD27513-200V10 vs NMC27C512AQ200
M27C512-20F1 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 STMicroelectronics QD27513-200V10 vs M27C512-20F1
NMC27C512AQ200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation QD27513-200V10 vs NMC27C512AQ200
LD27C513-200V10 UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 Intel Corporation QD27513-200V10 vs LD27C513-200V10
MSM27512-20AS UVPROM, 64KX8, 200ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 OKI Electric Industry Co Ltd QD27513-200V10 vs MSM27512-20AS
27LV512-20/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc QD27513-200V10 vs 27LV512-20/J
TD27C513-200V10 UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 Intel Corporation QD27513-200V10 vs TD27C513-200V10
Part Number Description Manufacturer Compare
AM27C512L-200DI UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD QD27513-200V10 vs AM27C512L-200DI
AM27C512-200DC UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion QD27513-200V10 vs AM27C512-200DC
TD27C513-200V10 UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 Intel Corporation QD27513-200V10 vs TD27C513-200V10
CY27C512-200WC UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor QD27513-200V10 vs CY27C512-200WC
AM27C512-200DIB UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion QD27513-200V10 vs AM27C512-200DIB
NM27P512QE200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation QD27513-200V10 vs NM27P512QE200
M27512-2F1 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics QD27513-200V10 vs M27512-2F1
27LV512-20/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc QD27513-200V10 vs 27LV512-20/J
TMM27512AD-20 IC 64K X 8 UVPROM, 200 ns, CDIP28, CERDIP-28, Programmable ROM Toshiba America Electronic Components QD27513-200V10 vs TMM27512AD-20
CY27C512-200WI UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor QD27513-200V10 vs CY27C512-200WI

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