Part Details for M27C512-20F6E by STMicroelectronics
Overview of M27C512-20F6E by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Healthcare
Telecommunications
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| AM27C512-200DI | Rochester Electronics LLC | UVPROM, | |
| AM27C512-255DC | Rochester Electronics LLC | UVPROM, | |
| AM27C512-70JI | Rochester Electronics LLC | OTP ROM, 64KX8, 70ns, CMOS, PQCC32, LCC-32 |
Part Details for M27C512-20F6E
M27C512-20F6E CAD Models
M27C512-20F6E Part Data Attributes
|
|
M27C512-20F6E
STMicroelectronics
Buy Now
Datasheet
|
Compare Parts:
M27C512-20F6E
STMicroelectronics
64KX8 UVPROM, 200ns, CDIP28, ROHS COMPLIANT, CERAMIC, DIP-28
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | ROHS COMPLIANT, CERAMIC, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e3 | |
| Length | 36.92 mm | |
| Memory Density | 524288 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.72 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for M27C512-20F6E
This table gives cross-reference parts and alternative options found for M27C512-20F6E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C512-20F6E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NMC27C512AQE200 | IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | M27C512-20F6E vs NMC27C512AQE200 |
| MBM27C512-20WZ | UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | M27C512-20F6E vs MBM27C512-20WZ |
| M27C512-20F1L | 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 | STMicroelectronics | M27C512-20F6E vs M27C512-20F1L |
| AM27C512-200DI | UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27C512-20F6E vs AM27C512-200DI |
| 27LV512-20/J | 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | M27C512-20F6E vs 27LV512-20/J |
| 27LV512-20I/J | 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | M27C512-20F6E vs 27LV512-20I/J |
| M27C512-20F1 | 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 | STMicroelectronics | M27C512-20F6E vs M27C512-20F1 |
| NMC27C512AQ200 | 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | M27C512-20F6E vs NMC27C512AQ200 |
| AM27C512-200/BXA | UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27C512-20F6E vs AM27C512-200/BXA |
| TMS27C512-20JL | 524 288-Bit Programmable Read-Only Memory 28-CDIP 0 to 70 | Texas Instruments | M27C512-20F6E vs TMS27C512-20JL |