Datasheets
LD27C256-200V10 by: Intel Corporation

UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28

Part Details for LD27C256-200V10 by Intel Corporation

Overview of LD27C256-200V10 by Intel Corporation

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Applications Computing and Data Storage

Part Details for LD27C256-200V10

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LD27C256-200V10 Part Data Attributes

LD27C256-200V10 Intel Corporation
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LD27C256-200V10 Intel Corporation UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Part Package Code DIP
Package Description WINDOWED, CERDIP-28
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Length 37.15 mm
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Programming Voltage 12.75 V
Qualification Status Not Qualified
Seated Height-Max 5.72 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for LD27C256-200V10

This table gives cross-reference parts and alternative options found for LD27C256-200V10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LD27C256-200V10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
NM27C256QE200 IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM Texas Instruments LD27C256-200V10 vs NM27C256QE200
TMS27C256-2JE 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 Texas Instruments LD27C256-200V10 vs TMS27C256-2JE
NMC27C256QE200 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments LD27C256-200V10 vs NMC27C256QE200
AM27C256-205DC UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD LD27C256-200V10 vs AM27C256-205DC
M27C256B-20XF7 32KX8 UVPROM, 200ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 STMicroelectronics LD27C256-200V10 vs M27C256B-20XF7
AM27C256-200DEB UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 Spansion LD27C256-200V10 vs AM27C256-200DEB
AM27C256-200DIB UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 Spansion LD27C256-200V10 vs AM27C256-200DIB
TMS27C256-20JE4 32KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments LD27C256-200V10 vs TMS27C256-20JE4
TMS27C256-20JE 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 Texas Instruments LD27C256-200V10 vs TMS27C256-20JE
CY27C256A-200WMB UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 Rochester Electronics LLC LD27C256-200V10 vs CY27C256A-200WMB
Part Number Description Manufacturer Compare
FT27C256R-20LM UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 Force Technologies Ltd LD27C256-200V10 vs FT27C256R-20LM
FT27C256R-20LMB UVPROM, 32KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Force Technologies Ltd LD27C256-200V10 vs FT27C256R-20LMB
UPD27C256AD-20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 NEC Electronics Group LD27C256-200V10 vs UPD27C256AD-20
QP27C256L-200/XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v LD27C256-200V10 vs QP27C256L-200/XA
QD27C256-200V10 UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 Intel Corporation LD27C256-200V10 vs QD27C256-200V10
CY27C256A-200WI UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor LD27C256-200V10 vs CY27C256A-200WI
NM27C256N200 OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 Fairchild Semiconductor Corporation LD27C256-200V10 vs NM27C256N200
WS27C256L-20DMB UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Waferscale Integration Inc LD27C256-200V10 vs WS27C256L-20DMB
AM27C256-205DCB UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD LD27C256-200V10 vs AM27C256-205DCB
AM27C256-200/BXA UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD LD27C256-200V10 vs AM27C256-200/BXA

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