Datasheets
KM23C8105B-12 by: Samsung Semiconductor

MASK ROM, 1MX8, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42

Part Details for KM23C8105B-12 by Samsung Semiconductor

Overview of KM23C8105B-12 by Samsung Semiconductor

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for KM23C8105B-12

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KM23C8105B-12 Part Data Attributes

KM23C8105B-12 Samsung Semiconductor
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KM23C8105B-12 Samsung Semiconductor MASK ROM, 1MX8, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP, DIP42,.6
Pin Count 42
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 120 ns
Alternate Memory Width 16
JESD-30 Code R-PDIP-T42
JESD-609 Code e0
Length 52.43 mm
Memory Density 8388608 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 42
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP42,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for KM23C8105B-12

This table gives cross-reference parts and alternative options found for KM23C8105B-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of KM23C8105B-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
LH538P00D-12 MASK ROM, 1MX8, 120ns, CMOS, PDIP42, Sharp Corp KM23C8105B-12 vs LH538P00D-12
LH538P00CD MASK ROM, 1MX8, 120ns, CMOS, PDIP42, DIP-42 Sharp Corp KM23C8105B-12 vs LH538P00CD
HN62438NP-12 1MX8 MASK PROM, 120ns, PDIP42, PLASTIC, DIP-42 Renesas Electronics Corporation KM23C8105B-12 vs HN62438NP-12
HN62438P-12 1MX8 MASK PROM, 120ns, PDIP42, PLASTIC, DIP-42 Renesas Electronics Corporation KM23C8105B-12 vs HN62438P-12
GM23C8100A-12 MASK ROM, 1MX8, 120ns, CMOS, PDIP42, LG Semicon Co Ltd KM23C8105B-12 vs GM23C8100A-12
LH53B8P00BD MASK ROM, 1MX8, 120ns, CMOS, PDIP42, DIP-42 Sharp Corp KM23C8105B-12 vs LH53B8P00BD
UPD23C8000XCZ-XXX MASK ROM, 1MX8, 120ns, MOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 NEC Electronics Group KM23C8105B-12 vs UPD23C8000XCZ-XXX
GM23C8100A-12 MASK ROM, 1MX8, 120ns, CMOS, PDIP42, Goldstar Electron Co Ltd KM23C8105B-12 vs GM23C8100A-12
HN62438P-12 MASK ROM, 1MX8, 120ns, CMOS, PDIP42, PLASTIC, DIP-42 Hitachi Ltd KM23C8105B-12 vs HN62438P-12
HN62448P-12 MASK ROM, 1MX8, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 Hitachi Ltd KM23C8105B-12 vs HN62448P-12
Part Number Description Manufacturer Compare
K3P4C1000D-DC12 MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42 Samsung Semiconductor KM23C8105B-12 vs K3P4C1000D-DC12
MX27C8100DC-17 UVPROM, 1MX8, 175ns, CMOS, CDIP42, CERAMIC, DIP-42 Macronix International Co Ltd KM23C8105B-12 vs MX27C8100DC-17
KM23C8100H-10 MASK ROM, 1MX8, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 Samsung Semiconductor KM23C8105B-12 vs KM23C8100H-10
MX27C8111PC-15 OTP ROM, 512KX16, 150ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 Macronix International Co Ltd KM23C8105B-12 vs MX27C8111PC-15
M27C800-100XF1 512KX16 UVPROM, 100ns, CDIP42, WINDOWED, FRIT SEALED, CERAMIC, DIP-42 STMicroelectronics KM23C8105B-12 vs M27C800-100XF1
KM23C8100B-10 MASK ROM, 1MX8, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 Samsung Semiconductor KM23C8105B-12 vs KM23C8100B-10
AM27C800-200DE UVPROM, 1MX8, 200ns, CMOS, CDIP42, WINDOWED, CERAMIC, DIP-42 AMD KM23C8105B-12 vs AM27C800-200DE
M27C800-90XB1 512KX16 OTPROM, 90ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42 STMicroelectronics KM23C8105B-12 vs M27C800-90XB1
K3P4C1000D-DC100 MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 Samsung Semiconductor KM23C8105B-12 vs K3P4C1000D-DC100
MSM538032E-XXRS MASK ROM, 512KX16, 150ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 OKI Electric Industry Co Ltd KM23C8105B-12 vs MSM538032E-XXRS

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