Part Details for K7A801800M-HC200 by Samsung Semiconductor
Overview of K7A801800M-HC200 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for K7A801800M-HC200
K7A801800M-HC200 CAD Models
K7A801800M-HC200 Part Data Attributes
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K7A801800M-HC200
Samsung Semiconductor
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Datasheet
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K7A801800M-HC200
Samsung Semiconductor
Cache SRAM, 512KX18, 3.1ns, CMOS, PBGA119, BGA-119
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 119 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 3.1 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
JESD-30 Code | R-PBGA-B119 | |
Length | 22 mm | |
Memory Density | 9437184 bit | |
Memory IC Type | CACHE SRAM | |
Memory Width | 18 | |
Number of Functions | 1 | |
Number of Terminals | 119 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX18 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Supply Voltage-Max (Vsup) | 3.465 V | |
Supply Voltage-Min (Vsup) | 3.135 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 14 mm |
Alternate Parts for K7A801800M-HC200
This table gives cross-reference parts and alternative options found for K7A801800M-HC200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K7A801800M-HC200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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CY7C1355V25-117BAC | ZBT SRAM, 256KX36, 7.5ns, CMOS, PBGA119, BGA-119 | Cypress Semiconductor | K7A801800M-HC200 vs CY7C1355V25-117BAC |
IS61SPS51218D-133B | Cache SRAM, 512KX18, 4ns, CMOS, PBGA119, PLASTIC, BGA-119 | Integrated Silicon Solution Inc | K7A801800M-HC200 vs IS61SPS51218D-133B |
UPD4481322F9-C50-EQX | ZBT SRAM, 256KX32, 3.2ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 | NEC Electronics Group | K7A801800M-HC200 vs UPD4481322F9-C50-EQX |
IDT71V659S80BG | ZBT SRAM, 512KX18, 8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | Integrated Device Technology Inc | K7A801800M-HC200 vs IDT71V659S80BG |
IDT71T658S133BG | ZBT SRAM, 512KX18, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | Integrated Device Technology Inc | K7A801800M-HC200 vs IDT71T658S133BG |
IBM0418A81NLAB-4 | Standard SRAM, 512KX18, 2.25ns, CMOS, PBGA119, BGA-119 | IBM | K7A801800M-HC200 vs IBM0418A81NLAB-4 |
UPD4382182GF-A67B | Cache SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 | NEC Electronics Group | K7A801800M-HC200 vs UPD4382182GF-A67B |
UPD4381322GF-A75 | ZBT SRAM, 256KX32, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 | NEC Electronics Group | K7A801800M-HC200 vs UPD4381322GF-A75 |
IDT71T657S80PF | ZBT SRAM, 256KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Integrated Device Technology Inc | K7A801800M-HC200 vs IDT71T657S80PF |
CY7C1360B-225AC | Cache SRAM, 256KX36, 2.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cypress Semiconductor | K7A801800M-HC200 vs CY7C1360B-225AC |