Part Details for UPD4481322F9-C50-EQX by NEC Electronics Group
Overview of UPD4481322F9-C50-EQX by NEC Electronics Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for UPD4481322F9-C50-EQX
UPD4481322F9-C50-EQX CAD Models
UPD4481322F9-C50-EQX Part Data Attributes
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UPD4481322F9-C50-EQX
NEC Electronics Group
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Datasheet
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UPD4481322F9-C50-EQX
NEC Electronics Group
ZBT SRAM, 256KX32, 3.2ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NEC ELECTRONICS CORP | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 165 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 3.2 ns | |
JESD-30 Code | R-PBGA-B165 | |
Length | 15 mm | |
Memory Density | 8388608 bit | |
Memory IC Type | ZBT SRAM | |
Memory Width | 32 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256KX32 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Supply Voltage-Max (Vsup) | 2.625 V | |
Supply Voltage-Min (Vsup) | 2.375 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |
Alternate Parts for UPD4481322F9-C50-EQX
This table gives cross-reference parts and alternative options found for UPD4481322F9-C50-EQX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of UPD4481322F9-C50-EQX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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CY7C1355V25-117BAC | ZBT SRAM, 256KX36, 7.5ns, CMOS, PBGA119, BGA-119 | Cypress Semiconductor | UPD4481322F9-C50-EQX vs CY7C1355V25-117BAC |
IS61SPS51218D-133B | Cache SRAM, 512KX18, 4ns, CMOS, PBGA119, PLASTIC, BGA-119 | Integrated Silicon Solution Inc | UPD4481322F9-C50-EQX vs IS61SPS51218D-133B |
IDT71V659S80BG | ZBT SRAM, 512KX18, 8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | Integrated Device Technology Inc | UPD4481322F9-C50-EQX vs IDT71V659S80BG |
IDT71T658S133BG | ZBT SRAM, 512KX18, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | Integrated Device Technology Inc | UPD4481322F9-C50-EQX vs IDT71T658S133BG |
IBM0418A81NLAB-4 | Standard SRAM, 512KX18, 2.25ns, CMOS, PBGA119, BGA-119 | IBM | UPD4481322F9-C50-EQX vs IBM0418A81NLAB-4 |
UPD4382182GF-A67B | Cache SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 | NEC Electronics Group | UPD4481322F9-C50-EQX vs UPD4382182GF-A67B |
UPD4381322GF-A75 | ZBT SRAM, 256KX32, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 | NEC Electronics Group | UPD4481322F9-C50-EQX vs UPD4381322GF-A75 |
IDT71T657S80PF | ZBT SRAM, 256KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Integrated Device Technology Inc | UPD4481322F9-C50-EQX vs IDT71T657S80PF |
CY7C1360B-225AC | Cache SRAM, 256KX36, 2.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cypress Semiconductor | UPD4481322F9-C50-EQX vs CY7C1360B-225AC |
IDT71V67802S166PFG | Cache SRAM, 512KX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Integrated Device Technology Inc | UPD4481322F9-C50-EQX vs IDT71V67802S166PFG |