There are no models available for this part yet.
Overview of K4J52324QH-HJ080 by Samsung Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 1 replacement )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Computing and Data Storage
CAD Models for K4J52324QH-HJ080 by Samsung Semiconductor
Part Data Attributes for K4J52324QH-HJ080 by Samsung Semiconductor
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
SAMSUNG SEMICONDUCTOR INC
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|
Part Package Code
|
BGA
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|
Package Description
|
TFBGA, BGA136,12X17,32
|
|
Pin Count
|
136
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|
Reach Compliance Code
|
unknown
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|
ECCN Code
|
EAR99
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HTS Code
|
8542.32.00.28
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|
Access Mode
|
MULTI BANK PAGE BURST
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|
Access Time-Max
|
0.19 ns
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Additional Feature
|
AUTO/SELF REFRESH
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|
Clock Frequency-Max (fCLK)
|
1200 MHz
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I/O Type
|
COMMON
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Interleaved Burst Length
|
4,8
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|
JESD-30 Code
|
R-PBGA-B136
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|
JESD-609 Code
|
e1
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Length
|
14 mm
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Memory Density
|
536870912 bit
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Memory IC Type
|
GDDR3 DRAM
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Memory Width
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32
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Moisture Sensitivity Level
|
3
|
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Number of Functions
|
1
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Number of Ports
|
1
|
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Number of Terminals
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136
|
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Number of Words
|
16777216 words
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|
Number of Words Code
|
16000000
|
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Operating Mode
|
SYNCHRONOUS
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Operating Temperature-Max
|
85 °C
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Operating Temperature-Min
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|
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Organization
|
16MX32
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Output Characteristics
|
3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
|
TFBGA
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Package Equivalence Code
|
BGA136,12X17,32
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Package Shape
|
RECTANGULAR
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Package Style
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GRID ARRAY, THIN PROFILE, FINE PITCH
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|
Peak Reflow Temperature (Cel)
|
260
|
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Qualification Status
|
Not Qualified
|
|
Refresh Cycles
|
8192
|
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Seated Height-Max
|
1.2 mm
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Self Refresh
|
YES
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Sequential Burst Length
|
4,8
|
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Standby Current-Max
|
0.1 A
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|
Supply Current-Max
|
1.34 mA
|
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Supply Voltage-Max (Vsup)
|
2.1 V
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|
Supply Voltage-Min (Vsup)
|
2 V
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Supply Voltage-Nom (Vsup)
|
2.05 V
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Surface Mount
|
YES
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Technology
|
CMOS
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Temperature Grade
|
OTHER
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Terminal Finish
|
TIN SILVER COPPER
|
|
Terminal Form
|
BALL
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Terminal Pitch
|
0.8 mm
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Terminal Position
|
BOTTOM
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Width
|
10 mm
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Alternate Parts for K4J52324QH-HJ080
This table gives cross-reference parts and alternative options found for K4J52324QH-HJ080. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4J52324QH-HJ080, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| K4J52324QH-HJ08T | Cache DRAM Module, 16MX32, 0.19ns, CMOS, PBGA136, | Samsung Semiconductor | K4J52324QH-HJ080 vs K4J52324QH-HJ08T |