Datasheets
K4J52324QH-HJ7A0 by: Samsung Semiconductor

DDR DRAM, 16MX32, 0.18ns, CMOS, PBGA136, HALOGEN FREE AND ROHS COMPLIANT, FBGA-136

Part Details for K4J52324QH-HJ7A0 by Samsung Semiconductor

Overview of K4J52324QH-HJ7A0 by Samsung Semiconductor

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Applications Consumer Electronics Computing and Data Storage

Part Details for K4J52324QH-HJ7A0

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K4J52324QH-HJ7A0 Part Data Attributes

K4J52324QH-HJ7A0 Samsung Semiconductor
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K4J52324QH-HJ7A0 Samsung Semiconductor DDR DRAM, 16MX32, 0.18ns, CMOS, PBGA136, HALOGEN FREE AND ROHS COMPLIANT, FBGA-136
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA
Package Description TFBGA, BGA136,12X17,32
Pin Count 136
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.28
Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.18 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 1300 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B136
JESD-609 Code e1
Length 14 mm
Memory Density 536870912 bit
Memory IC Type GDDR3 DRAM
Memory Width 32
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 1
Number of Terminals 136
Number of Words 16777216 words
Number of Words Code 16000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 16MX32
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA136,12X17,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 4,8
Standby Current-Max 0.109 A
Supply Current-Max 1.452 mA
Supply Voltage-Max (Vsup) 2.1 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 2.05 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 10 mm

Alternate Parts for K4J52324QH-HJ7A0

This table gives cross-reference parts and alternative options found for K4J52324QH-HJ7A0. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4J52324QH-HJ7A0, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
K4J52324QC-BC140 DDR DRAM, 16MX32, 0.26ns, CMOS, PBGA136, ROHS COMPLIANT, FBGA-136 Samsung Semiconductor K4J52324QH-HJ7A0 vs K4J52324QC-BC140
H5RS5223CFR-18C DDR DRAM, 16MX32, CMOS, PBGA126, 10 X 14 MM, ROHS COMPLIANT, FBGA-136 SK Hynix Inc K4J52324QH-HJ7A0 vs H5RS5223CFR-18C
HYB18H512321BF-14 Synchronous Graphics RAM, 16MX32, 0.25ns, CMOS, PBGA136, 10 X 14 MM, GREEN, PLASTIC, MO-207IDR-Z, TFBGA-136 Qimonda AG K4J52324QH-HJ7A0 vs HYB18H512321BF-14
K4J52324QC-AC200 DDR DRAM, 16MX32, 0.35ns, CMOS, PBGA136, FBGA-136 Samsung Semiconductor K4J52324QH-HJ7A0 vs K4J52324QC-AC200
HY5RS123235FP-11 DDR DRAM, 16MX32, 0.25ns, CMOS, PBGA136, 12 X 14 MM, LEAD FREE, FBGA-136 SK Hynix Inc K4J52324QH-HJ7A0 vs HY5RS123235FP-11
K4J52324QH-HC120 DDR DRAM, 16MX32, 0.23ns, CMOS, PBGA136, HALOGEN FREE AND ROHS COMPLIANT, FBGA-136 Samsung Semiconductor K4J52324QH-HJ7A0 vs K4J52324QH-HC120
HY5FS123235AFCP-06 DDR DRAM, 16MX32, 0.14ns, CMOS, PBGA136, ROHS COMPLIANT, MO-207, FBGA-136 SK Hynix Inc K4J52324QH-HJ7A0 vs HY5FS123235AFCP-06
K4J52324QC-BC160 DDR DRAM, 16MX32, 0.29ns, CMOS, PBGA136, ROHS COMPLIANT, FBGA-136 Samsung Semiconductor K4J52324QH-HJ7A0 vs K4J52324QC-BC160
H5RS5223CFR-N3C DDR DRAM, 16MX32, CMOS, PBGA126, 10 X 14 MM, ROHS COMPLIANT, FBGA-136 SK Hynix Inc K4J52324QH-HJ7A0 vs H5RS5223CFR-N3C
HY5FS123235AFCP-07 DDR DRAM, 16MX32, 0.16ns, CMOS, PBGA136, ROHS COMPLIANT, MO-207, FBGA-136 SK Hynix Inc K4J52324QH-HJ7A0 vs HY5FS123235AFCP-07

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