There are no models available for this part yet.
Overview of K4C89183AF-GIG70 by Samsung Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Computing and Data Storage
CAD Models for K4C89183AF-GIG70 by Samsung Semiconductor
Part Data Attributes for K4C89183AF-GIG70 by Samsung Semiconductor
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|
|---|---|
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Pbfree Code
|
No
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|
Rohs Code
|
No
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|
Part Life Cycle Code
|
Obsolete
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|
Ihs Manufacturer
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SAMSUNG SEMICONDUCTOR INC
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Part Package Code
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BGA
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Package Description
|
BGA,
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Pin Count
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60
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Reach Compliance Code
|
compliant
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ECCN Code
|
EAR99
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HTS Code
|
8542.32.00.28
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Access Mode
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FOUR BANK PAGE BURST
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Access Time-Max
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0.5 ns
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Additional Feature
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AUTO/SELF REFRESH
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JESD-30 Code
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R-PBGA-B60
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JESD-609 Code
|
e0
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Memory Density
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301989888 bit
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Memory IC Type
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DDR1 DRAM
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Memory Width
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18
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Number of Functions
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1
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Number of Ports
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1
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Number of Terminals
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60
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Number of Words
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16777216 words
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Number of Words Code
|
16000000
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Operating Mode
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SYNCHRONOUS
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Organization
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16MX18
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Package Body Material
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PLASTIC/EPOXY
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Package Code
|
BGA
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY
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Qualification Status
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Not Qualified
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Self Refresh
|
YES
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Supply Voltage-Max (Vsup)
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2.625 V
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Supply Voltage-Min (Vsup)
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2.375 V
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Supply Voltage-Nom (Vsup)
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2.5 V
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Surface Mount
|
YES
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Technology
|
CMOS
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Terminal Finish
|
TIN LEAD
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Terminal Form
|
BALL
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Terminal Position
|
BOTTOM
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Alternate Parts for K4C89183AF-GIG70
This table gives cross-reference parts and alternative options found for K4C89183AF-GIG70. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4C89183AF-GIG70, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| K4C89183AF-ACFB0 | DDR DRAM, 16MX18, 0.5ns, CMOS, PBGA60, 1 MM PITCH, FBGA-60 | Samsung Semiconductor | K4C89183AF-GIG70 vs K4C89183AF-ACFB0 |
| K4C89183AF-GCF6 | DDR DRAM, 16MX18, 0.5ns, CMOS, PBGA60, 1 MM PITCH, FBGA-60 | Samsung Semiconductor | K4C89183AF-GIG70 vs K4C89183AF-GCF6 |
| K4C89183AF-ACF60 | DDR DRAM, 16MX18, 0.5ns, CMOS, PBGA60, 1 MM PITCH, FBGA-60 | Samsung Semiconductor | K4C89183AF-GIG70 vs K4C89183AF-ACF60 |
| K4C89183AF-GCG70 | DDR DRAM, 16MX18, 0.5ns, CMOS, PBGA60, 1 MM PITCH, FBGA-60 | Samsung Semiconductor | K4C89183AF-GIG70 vs K4C89183AF-GCG70 |
| K4C89183AF-GCF50 | DDR DRAM, 16MX18, 0.6ns, CMOS, PBGA60, 1 X 1 MM PITCH, FBGA-60 | Samsung Semiconductor | K4C89183AF-GIG70 vs K4C89183AF-GCF50 |
| TC59LM818DMGI-37 | IC 16M X 18 DDR DRAM, 0.65 ns, PBGA60, 9 X 17 MM, 1.00 MM PITCH, LEAD FREE, PLASTIC, TFBGA-60, Dynamic RAM | Toshiba America Electronic Components | K4C89183AF-GIG70 vs TC59LM818DMGI-37 |
| K4C89183AF-GCF5 | DDR DRAM, 16MX18, 0.6ns, CMOS, PBGA60, 1 MM PITCH, FBGA-60 | Samsung Semiconductor | K4C89183AF-GIG70 vs K4C89183AF-GCF5 |
| TC59LM818DMB-40 | IC 16M X 18 DDR DRAM, 0.65 ns, PBGA60, 9 X 17 MM, 1 MM PITCH, PLASTIC, BGA-60, Dynamic RAM | Toshiba America Electronic Components | K4C89183AF-GIG70 vs TC59LM818DMB-40 |
| TC59LM818DMBI-37 | IC 16M X 18 DDR DRAM, 0.65 ns, PBGA60, 9 X 17 MM, 1 MM PITCH, PLASTIC, BGA-60, Dynamic RAM | Toshiba America Electronic Components | K4C89183AF-GIG70 vs TC59LM818DMBI-37 |
| K4C89183AF-GCFB | DDR DRAM, 16MX18, 0.5ns, CMOS, PBGA60, 1 MM PITCH, FBGA-60 | Samsung Semiconductor | K4C89183AF-GIG70 vs K4C89183AF-GCFB |