K4C89183AF-GIG70
vs
K4C89183AF-ACF60
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
TBGA,
Pin Count
60
60
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.5 ns
0.5 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e0
e0
Memory Density
301989888 bit
301989888 bit
Memory IC Type
DDR1 DRAM
DDR1 DRAM
Memory Width
18
18
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
16MX18
16MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Length
15.5 mm
Operating Temperature-Max
85 °C
Operating Temperature-Min
Seated Height-Max
1.2 mm
Temperature Grade
OTHER
Terminal Pitch
1 mm
Width
10.5 mm
Compare K4C89183AF-GIG70 with alternatives
Compare K4C89183AF-ACF60 with alternatives