Datasheets
EDI88130CS55L32B by:

Standard SRAM, 128KX8, 55ns, CMOS, CQCC32, LCC-32

Part Details for EDI88130CS55L32B by Microsemi Corporation

Overview of EDI88130CS55L32B by Microsemi Corporation

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Part Details for EDI88130CS55L32B

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EDI88130CS55L32B Part Data Attributes

EDI88130CS55L32B Microsemi Corporation
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EDI88130CS55L32B Microsemi Corporation Standard SRAM, 128KX8, 55ns, CMOS, CQCC32, LCC-32
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Part Package Code QFJ
Package Description QCCN,
Pin Count 32
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 55 ns
JESD-30 Code R-CQCC-N32
JESD-609 Code e0
Length 13.97 mm
Memory Density 1048576 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QCCN
Package Shape RECTANGULAR
Package Style CHIP CARRIER
Parallel/Serial PARALLEL
Screening Level MIL-STD-883
Seated Height-Max 3.048 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 11.43 mm

Alternate Parts for EDI88130CS55L32B

This table gives cross-reference parts and alternative options found for EDI88130CS55L32B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI88130CS55L32B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
EDI88130CS55LI Standard SRAM, 128KX8, 55ns, CMOS, CDSO32, LCC-32 Microsemi Corporation EDI88130CS55L32B vs EDI88130CS55LI
EDI88130CS55LM Standard SRAM, 128KX8, 55ns, CMOS, CDSO32, LCC-32 Microsemi Corporation EDI88130CS55L32B vs EDI88130CS55LM
EDI88130CS55LC Standard SRAM, 128KX8, 55ns, CMOS, CDSO32, CERAMIC, LCC-32 Microsemi Corporation EDI88130CS55L32B vs EDI88130CS55LC
Part Number Description Manufacturer Compare
U621708TK07G1 Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, LEAD FREE, TSOP1-32 ZMDI EDI88130CS55L32B vs U621708TK07G1
TC55V2001TR-10L IC 256K X 8 STANDARD SRAM, 100 ns, PDSO32, 8 X 20 MM, 0.50 MM PITCH, REVERSE, PLASTIC, TSOP1-32, Static RAM Toshiba America Electronic Components EDI88130CS55L32B vs TC55V2001TR-10L
HM62Y8128DLTSI-12UL 128KX8 STANDARD SRAM, 120ns, PDSO32, 8 X 13.40 MM, PLASTIC, TSOP1-32 Renesas Electronics Corporation EDI88130CS55L32B vs HM62Y8128DLTSI-12UL
AS7C1024B-20STI Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32 Alliance Semiconductor Corporation EDI88130CS55L32B vs AS7C1024B-20STI
HM62Y8128DLTI-12UL Standard SRAM, 128KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 Hitachi Ltd EDI88130CS55L32B vs HM62Y8128DLTI-12UL
8959812BXA Standard SRAM, 128KX8, 25ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components EDI88130CS55L32B vs 8959812BXA
MSM8128KXMB-45 Standard SRAM, 128KX8, 45ns, CMOS, CDIP32, Mosaic Semiconductor Inc EDI88130CS55L32B vs MSM8128KXMB-45
UL62H1708AS1A55G1 Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 0.330 INCH, SOP-32 ZMDI EDI88130CS55L32B vs UL62H1708AS1A55G1
8959808BUC Standard SRAM, 128KX8, 70ns, CMOS, CDSO32, CERAMIC, LCC-32 Micross Components EDI88130CS55L32B vs 8959808BUC
EDI88130CS25NB Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, CERAMIC, SOJ-32 Microsemi Corporation EDI88130CS55L32B vs EDI88130CS25NB

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