Datasheets
8959812BXA by: Micross Components

Standard SRAM, 128KX8, 25ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32

Part Details for 8959812BXA by Micross Components

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Part Details for 8959812BXA

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8959812BXA Part Data Attributes

8959812BXA Micross Components
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8959812BXA Micross Components Standard SRAM, 128KX8, 25ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32
Part Life Cycle Code Transferred
Ihs Manufacturer AUSTIN SEMICONDUCTOR INC
Part Package Code DIP
Package Description 0.600 INCH, CERAMIC, DIP-32
Pin Count 32
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 25 ns
JESD-30 Code R-CDIP-T32
JESD-609 Code e4
Length 40.64 mm
Memory Density 1048576 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.34 mm
Standby Voltage-Min 2 V
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish PALLADIUM GOLD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for 8959812BXA

This table gives cross-reference parts and alternative options found for 8959812BXA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 8959812BXA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
U621708TK07G1 Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, LEAD FREE, TSOP1-32 ZMDI 8959812BXA vs U621708TK07G1
TC55V2001TR-10L IC 256K X 8 STANDARD SRAM, 100 ns, PDSO32, 8 X 20 MM, 0.50 MM PITCH, REVERSE, PLASTIC, TSOP1-32, Static RAM Toshiba America Electronic Components 8959812BXA vs TC55V2001TR-10L
HM62Y8128DLTSI-12UL 128KX8 STANDARD SRAM, 120ns, PDSO32, 8 X 13.40 MM, PLASTIC, TSOP1-32 Renesas Electronics Corporation 8959812BXA vs HM62Y8128DLTSI-12UL
AS7C1024B-20STI Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32 Alliance Semiconductor Corporation 8959812BXA vs AS7C1024B-20STI
HM62Y8128DLTI-12UL Standard SRAM, 128KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 Hitachi Ltd 8959812BXA vs HM62Y8128DLTI-12UL
MSM8128KXMB-45 Standard SRAM, 128KX8, 45ns, CMOS, CDIP32, Mosaic Semiconductor Inc 8959812BXA vs MSM8128KXMB-45
UL62H1708AS1A55G1 Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 0.330 INCH, SOP-32 ZMDI 8959812BXA vs UL62H1708AS1A55G1
8959808BUC Standard SRAM, 128KX8, 70ns, CMOS, CDSO32, CERAMIC, LCC-32 Micross Components 8959812BXA vs 8959808BUC
EDI88130CS25NB Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, CERAMIC, SOJ-32 Microsemi Corporation 8959812BXA vs EDI88130CS25NB
8959836BZC Standard SRAM, 128KX8, 35ns, CMOS, CDIP32, 0.400 INCH, CERAMIC, DIP-32 Micross Components 8959812BXA vs 8959836BZC

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