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Memory / SRAMs / DPS512S8BN-35M
Datasheets
DPS512S8BN-35M by:

SRAM Module, 512KX8, 35ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32

Part Details for DPS512S8BN-35M by Twilight Technology Inc

Overview of DPS512S8BN-35M by Twilight Technology Inc

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
LPS6235-123MLC Coilcraft Inc General Purpose Inductor, 12uH, 20%, 1 Element, Ferrite-Core, SMD, 6262-35M, CHIP, 6262-35M, ROHS COMPLIANT
LPS6235-183MLC Coilcraft Inc General Purpose Inductor, 18uH, 20%, 1 Element, Ferrite-Core, SMD, 6262-35M, CHIP, 6262-35M, ROHS COMPLIANT
LPS6235-334MLC Coilcraft Inc General Purpose Inductor, 330uH, 20%, 1 Element, Ferrite-Core, SMD, 6262-35M, CHIP, 6262-35M, ROHS COMPLIANT

Part Details for DPS512S8BN-35M

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DPS512S8BN-35M Part Data Attributes

Parametric Data
DPS512S8BN-35M Twilight Technology Inc
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DPS512S8BN-35M Twilight Technology Inc SRAM Module, 512KX8, 35ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32
Pbfree Code No
Rohs Code No
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer TWILIGHT TECHNOLOGY INC
Part Package Code MODULE
Package Description ,
Pin Count 32
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 35 ns
JESD-30 Code R-CDMA-T32
Length 42.164 mm
Memory Density 4194304 bit
Memory IC Type SRAM MODULE
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Supply Current-Max 0.235 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Alternate Parts for DPS512S8BN-35M

This table gives cross-reference parts and alternative options found for DPS512S8BN-35M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS512S8BN-35M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AS5C4008CW-35E/883C Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components DPS512S8BN-35M vs AS5C4008CW-35E/883C
WS512K8-35CQ SRAM Module, 512KX8, 35ns, CMOS, CDMA32, 0.600 INCH, CERAMIC, DIP-32 Mercury Systems Inc DPS512S8BN-35M vs WS512K8-35CQ
5962-9561307HYA Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32 Mercury Systems Inc DPS512S8BN-35M vs 5962-9561307HYA
5962-9207807HXC SRAM Module, 512KX8, 35ns, CMOS, DIP-32 Mercury Systems Inc DPS512S8BN-35M vs 5962-9207807HXC
5962-9561312HYA Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32 White Microelectronics DPS512S8BN-35M vs 5962-9561312HYA
5962-9207807HTX SRAM Module, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Mercury Systems Inc DPS512S8BN-35M vs 5962-9207807HTX
MS8512SCLMB-35 SRAM Module, 512KX8, 35ns, CMOS Mosaic Semiconductor Inc DPS512S8BN-35M vs MS8512SCLMB-35
DPS512S8AP-35I SRAM Module, 512KX8, 35ns, CMOS, CDMA32, CERDIP-32 Twilight Technology Inc DPS512S8BN-35M vs DPS512S8AP-35I
WMS512K8-35CIA Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc DPS512S8BN-35M vs WMS512K8-35CIA
DPS512S8BN-35B SRAM Module, 512KX8, 35ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32 Twilight Technology Inc DPS512S8BN-35M vs DPS512S8BN-35B
Part Number Description Manufacturer Compare
WS128K32-45HSME SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp DPS512S8BN-35M vs WS128K32-45HSME
CY7C194-35LC Standard SRAM, 64KX4, 35ns, CMOS, LCC-28 Cypress Semiconductor DPS512S8BN-35M vs CY7C194-35LC
SMDP-65656L45 Standard SRAM, 32KX8, CMOS, CDFP28, Temic Semiconductors DPS512S8BN-35M vs SMDP-65656L45
FT6264-45PCLF Standard SRAM, 8KX8, 45ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Force Technologies Ltd DPS512S8BN-35M vs FT6264-45PCLF
FT6198A-20DC Standard SRAM, 16KX4, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Force Technologies Ltd DPS512S8BN-35M vs FT6198A-20DC
WS128K32V-20G4S SRAM Module, 512KX8, 20ns, CMOS, White Electronic Designs Corp DPS512S8BN-35M vs WS128K32V-20G4S
WS128K32-20G4I SRAM Module, 512KX8, 20ns, CMOS, CQFP68, 40 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp DPS512S8BN-35M vs WS128K32-20G4I
MB8287-35PSK Standard SRAM, 32KX8, 35ns, CMOS, PDIP32, 0.300 INCH, SKINNY, PLASTIC, DIP-32 FUJITSU Semiconductor Limited DPS512S8BN-35M vs MB8287-35PSK
WS128K32-45G2IA SRAM Module, 512KX8, 45ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp DPS512S8BN-35M vs WS128K32-45G2IA
IMS1820W-35 64KX4 STANDARD SRAM, 35ns, CQCC28, CERAMIC, LCC-28 STMicroelectronics DPS512S8BN-35M vs IMS1820W-35

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