Part Details for DM54S475AJ by National Semiconductor Corporation
Overview of DM54S475AJ by National Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DM54S475AJ
DM54S475AJ CAD Models
DM54S475AJ Part Data Attributes
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DM54S475AJ
National Semiconductor Corporation
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Datasheet
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DM54S475AJ
National Semiconductor Corporation
IC 512 X 8 OTPROM, 60 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Package Description | DIP, DIP24,.6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 60 ns | |
| JESD-30 Code | R-GDIP-T24 | |
| JESD-609 Code | e0 | |
| Memory Density | 4096 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 512 words | |
| Number of Words Code | 512 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512X8 | |
| Output Characteristics | OPEN-COLLECTOR | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.572 mm | |
| Supply Current-Max | 0.17 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for DM54S475AJ
This table gives cross-reference parts and alternative options found for DM54S475AJ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DM54S475AJ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| N82S115I | IC 512 X 8 OTPROM, 60 ns, CDIP24, Programmable ROM | NXP Semiconductors | DM54S475AJ vs N82S115I |
| N82S215I | OTP ROM, 512X8, 60ns, Bipolar, CDIP24, | Signetics | DM54S475AJ vs N82S215I |
| AM27S15DC | OTP ROM, 512X8, 60ns, Bipolar, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | DM54S475AJ vs AM27S15DC |
| N82S115N | IC 512 X 8 OTPROM, 60 ns, PDIP24, 0.600 INCH, PLASTIC, DIP-24, Programmable ROM | NXP Semiconductors | DM54S475AJ vs N82S115N |
| AM27S15PC | OTP ROM, 512X8, 60ns, Bipolar, PDIP24, PLASTIC, DIP-24 | AMD | DM54S475AJ vs AM27S15PC |
| N82S115I | OTP ROM, 512X8, 60ns, Bipolar, CDIP24, | Signetics | DM54S475AJ vs N82S115I |
| TBP28S46NW | 512X8 OTPROM, 60ns, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Texas Instruments | DM54S475AJ vs TBP28S46NW |
| N82S115NB | IC 512 X 8 OTPROM, 60 ns, PDIP24, Programmable ROM | NXP Semiconductors | DM54S475AJ vs N82S115NB |
| N82S215I | 512X8 OTPROM, 60ns, CDIP24 | Philips Semiconductors | DM54S475AJ vs N82S215I |
| N82S115N | OTP ROM, 512X8, 60ns, Bipolar, PDIP24, | YAGEO Corporation | DM54S475AJ vs N82S115N |