Part Details for N82S115I by NXP Semiconductors
Overview of N82S115I by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for N82S115I
N82S115I CAD Models
N82S115I Part Data Attributes:
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N82S115I
NXP Semiconductors
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Datasheet
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N82S115I
NXP Semiconductors
IC 512 X 8 OTPROM, 60 ns, CDIP24, Programmable ROM
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SIGNETICS CORP | |
| Package Description | DIP, DIP24,.6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 60 ns | |
| JESD-30 Code | R-CDIP-T24 | |
| JESD-609 Code | e0 | |
| Memory Density | 4096 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 512 words | |
| Number of Words Code | 512 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | ||
| Organization | 512X8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for N82S115I
This table gives cross-reference parts and alternative options found for N82S115I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of N82S115I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| N82S215I | IC 512 X 8 OTPROM, 60 ns, CDIP24, Programmable ROM | NXP Semiconductors | N82S115I vs N82S215I |
| N82S115NB | 512X8 OTPROM, 60ns, PDIP24 | Philips Semiconductors | N82S115I vs N82S115NB |
| AM27S15DCB | OTP ROM, 512X8, 60ns, Bipolar, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | N82S115I vs AM27S15DCB |
| AM27S15DC | OTP ROM, 512X8, 60ns, Bipolar, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | N82S115I vs AM27S15DC |
| DM54S475AJ | 512X8 OTPROM, 60ns, CDIP24, CERAMIC, DIP-24 | Texas Instruments | N82S115I vs DM54S475AJ |
| N82S115NB | IC 512 X 8 OTPROM, 60 ns, PDIP24, Programmable ROM | NXP Semiconductors | N82S115I vs N82S115NB |
| N82S115N | IC 512 X 8 OTPROM, 60 ns, PDIP24, 0.600 INCH, PLASTIC, DIP-24, Programmable ROM | NXP Semiconductors | N82S115I vs N82S115N |
| DM54S474AJ | 512X8 OTPROM, 60ns, CDIP24, CERAMIC, DIP-24 | Texas Instruments | N82S115I vs DM54S474AJ |
| AM27S15PC | OTP ROM, 512X8, 60ns, Bipolar, PDIP24, PLASTIC, DIP-24 | AMD | N82S115I vs AM27S15PC |
| TBP28S46NW | 512X8 OTPROM, 60ns, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Texas Instruments | N82S115I vs TBP28S46NW |