DM54S475AJ vs CY7C225-30DMB feature comparison

DM54S475AJ National Semiconductor Corporation

Buy Now Datasheet

CY7C225-30DMB Cypress Semiconductor

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Package Description DIP, DIP24,.6 DIP, DIP24,.3
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 60 ns 20 ns
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Memory Density 4096 bit 4096 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512X8 512X8
Output Characteristics OPEN-COLLECTOR 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.6 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm
Supply Current-Max 0.17 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 4 1
Pbfree Code No
Part Package Code DIP
Pin Count 24
Additional Feature BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS
I/O Type COMMON
Programming Voltage 13.5 V
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.12 A

Compare DM54S475AJ with alternatives

Compare CY7C225-30DMB with alternatives