Memory
AM27C1024-150DCB
Description: UVPROM, 64KX16, 150ns, CMOS, CDIP40, CERAMIC, DIP-40

Overview of AM27C1024-150DCB by Spansion

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Industrial Automation Computing and Data Storage Financial Technology (Fintech) Telecommunications

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Part Data Attributes for AM27C1024-150DCB by Spansion

AM27C1024-150DCB
Spansion
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SPANSION INC
Part Package Code
DIP
Package Description
DIP,
Pin Count
40
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
150 ns
JESD-30 Code
R-CDIP-T40
Length
52.26 mm
Memory Density
1048576 bit
Memory IC Type
UVPROM
Memory Width
16
Number of Functions
1
Number of Terminals
40
Number of Words
65536 words
Number of Words Code
64000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
64KX16
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.588 mm
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
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  1. AM27C1024-150DCB
    Spansion
    UVPROM, 64KX16, 150ns, CMOS, CDIP40, CERAMIC, DIP-40
    VS

Alternate Parts for AM27C1024-150DCB

This table gives cross-reference parts and alternative options found for AM27C1024-150DCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C1024-150DCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
CAT27C210D-15 UVPROM, 64KX16, 150ns, CMOS, CDIP40, 0.600 INCH, CERDIP-40 Catalyst Semiconductor AM27C1024-150DCB vs CAT27C210D-15
WS27C210L-15D UVPROM, 64KX16, 150ns, CMOS, CDIP40, Waferscale Integration Inc AM27C1024-150DCB vs WS27C210L-15D
AM27C1024-150DIB UVPROM, 64KX16, 150ns, CMOS, CDIP40, CERAMIC, DIP-40 AMD AM27C1024-150DCB vs AM27C1024-150DIB
27C210-150V10 UVPROM, 64KX16, 150ns, CMOS, CDIP40, WINDOWED, CERDIP-40 Intel Corporation AM27C1024-150DCB vs 27C210-150V10
NM27P210QM150 64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40 Texas Instruments AM27C1024-150DCB vs NM27P210QM150
27C1024MQB/T15 UVPROM, Atmel Corporation AM27C1024-150DCB vs 27C1024MQB/T15
NM27C210Q150 UVPROM, 64KX16, 150ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 Fairchild Semiconductor Corporation AM27C1024-150DCB vs NM27C210Q150
NM27P210QE150 64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40 Texas Instruments AM27C1024-150DCB vs NM27P210QE150
NM27P210QE150 IC 64K X 16 UVPROM, 150 ns, CDIP40, WINDOWED, CERAMIC, DIP-40, Programmable ROM National Semiconductor Corporation AM27C1024-150DCB vs NM27P210QE150
TMS27C210A-15JL4 64KX16 UVPROM, 150ns, CDIP40, 0.600 INCH, WINDOWED, CERAMIC, DIP-40 Texas Instruments AM27C1024-150DCB vs TMS27C210A-15JL4
Part Number Description Manufacturer Compare
M27C1024-80F6X 64KX16 UVPROM, 80ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 STMicroelectronics AM27C1024-150DCB vs M27C1024-80F6X
AT27C1024-55LI UVPROM, 64KX16, 55ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 Atmel Corporation AM27C1024-150DCB vs AT27C1024-55LI
M27C1024-45F6X 64KX16 UVPROM, 45ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 STMicroelectronics AM27C1024-150DCB vs M27C1024-45F6X
TC57H1024D-100 IC 64K X 16 UVPROM, 100 ns, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40, Programmable ROM Toshiba America Electronic Components AM27C1024-150DCB vs TC57H1024D-100
NM27C210QE120 UVPROM, 64KX16, 120ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 Fairchild Semiconductor Corporation AM27C1024-150DCB vs NM27C210QE120
AM27C1024-255DIB UVPROM, 64KX16, 250ns, CMOS, CDIP40, CERAMIC, DIP-40 Spansion AM27C1024-150DCB vs AM27C1024-255DIB
AM27C1024-55DC UVPROM, 64KX16, 55ns, CMOS, CDIP40, CERAMIC, DIP-40 AMD AM27C1024-150DCB vs AM27C1024-55DC
AT27C1024-20DM UVPROM, 64KX16, 200ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 Atmel Corporation AM27C1024-150DCB vs AT27C1024-20DM
CY7B210-25HC UVPROM, 64KX16, 25ns, BICMOS, CQCC44, WINDOWED, HERMETIC SEALED, CERAMIC, LCC-44 Cypress Semiconductor AM27C1024-150DCB vs CY7B210-25HC
27C1024DESC06QA UVPROM, 64KX16, 120ns, CMOS, CDIP40, WINDOWED, CERDIP-40 Teledyne e2v AM27C1024-150DCB vs 27C1024DESC06QA

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