AM27C1024-150DCB vs CY7B210-25HC feature comparison

AM27C1024-150DCB Spansion

Buy Now Datasheet

CY7B210-25HC Cypress Semiconductor

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP LCC
Package Description DIP, WINDOWED, HERMETIC SEALED, CERAMIC, LCC-44
Pin Count 40 44
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 150 ns 25 ns
JESD-30 Code R-CDIP-T40 S-CQCC-J44
Length 52.26 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type UVPROM UVPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 40 44
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX16 64KX16
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP QCCJ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm
Supply Current-Max 0.05 mA 0.24 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS BICMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 15.24 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Additional Feature POWER DOWN PROM
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code LDCC44,.7SQ
Terminal Finish TIN LEAD

Compare AM27C1024-150DCB with alternatives

Compare CY7B210-25HC with alternatives