AM27C1024-150DCB
vs
CY7B210-25HC
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SPANSION INC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
DIP
|
LCC
|
Package Description |
DIP,
|
WINDOWED, HERMETIC SEALED, CERAMIC, LCC-44
|
Pin Count |
40
|
44
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.61
|
8542.32.00.61
|
Access Time-Max |
150 ns
|
25 ns
|
JESD-30 Code |
R-CDIP-T40
|
S-CQCC-J44
|
Length |
52.26 mm
|
|
Memory Density |
1048576 bit
|
1048576 bit
|
Memory IC Type |
UVPROM
|
UVPROM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
40
|
44
|
Number of Words |
65536 words
|
65536 words
|
Number of Words Code |
64000
|
64000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
64KX16
|
64KX16
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
QCCJ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.588 mm
|
|
Supply Current-Max |
0.05 mA
|
0.24 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
J BEND
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
15.24 mm
|
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Additional Feature |
|
POWER DOWN PROM
|
I/O Type |
|
COMMON
|
JESD-609 Code |
|
e0
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
LDCC44,.7SQ
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare AM27C1024-150DCB with alternatives
Compare CY7B210-25HC with alternatives