Part Details for AM10470ADC by AMD
Overview of AM10470ADC by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Renewable Energy
Automotive
Part Details for AM10470ADC
AM10470ADC CAD Models
AM10470ADC Part Data Attributes
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AM10470ADC
AMD
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Datasheet
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AM10470ADC
AMD
Standard SRAM, 4KX1, 25ns, ECL, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP18,.3 | |
| Pin Count | 18 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 25 ns | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-GDIP-T18 | |
| JESD-609 Code | e0 | |
| Length | 22.86 mm | |
| Memory Density | 4096 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 1 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 18 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | ||
| Organization | 4KX1 | |
| Output Characteristics | OPEN-EMITTER | |
| Output Enable | NO | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP18,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.2 mA | |
| Surface Mount | NO | |
| Technology | ECL | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for AM10470ADC
This table gives cross-reference parts and alternative options found for AM10470ADC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM10470ADC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HM3-65767BM-5:D | Standard SRAM, 16KX1, 40ns, CMOS, PDIP20 | Matra MHS | AM10470ADC vs HM3-65767BM-5:D |
| HM4-65262B/883:RD | Standard SRAM, 16KX1, 70ns, CMOS, CQCC20 | Matra MHS | AM10470ADC vs HM4-65262B/883:RD |
| HM4-65767BN-6:RD | Standard SRAM, 16KX1, 55ns, CMOS, CQCC20 | Matra MHS | AM10470ADC vs HM4-65767BN-6:RD |
| CY7C167-25VC | Standard SRAM, 16KX1, 25ns, CMOS, PDSO20, PLASTIC, SOJ-20 | Cypress Semiconductor | AM10470ADC vs CY7C167-25VC |
| QD2148H-2 | Standard SRAM, 1KX4, 45ns, NMOS, CDIP18, CERDIP-18 | Intel Corporation | AM10470ADC vs QD2148H-2 |
| 8413206RA | CDIP-20, Tube | Integrated Device Technology Inc | AM10470ADC vs 8413206RA |
| AM21L47-55LC | Standard SRAM, 4KX1, 55ns, NMOS, CQCC18, CERAMIC, LCC-18 | AMD | AM10470ADC vs AM21L47-55LC |
| AM2167-55DEB | Standard SRAM, 16KX1, 50ns, NMOS, CDIP20, HERMETIC SEALED, CERAMIC, DIP-20 | AMD | AM10470ADC vs AM2167-55DEB |
| CY2148-45DC | Standard SRAM, 1KX4, 45ns, CMOS, PDIP18, DIP-18 | Cypress Semiconductor | AM10470ADC vs CY2148-45DC |
| HM10480 | Standard SRAM, 16KX1, 25ns, ECL, CDIP20, CERDIP-20 | Hitachi Ltd | AM10470ADC vs HM10480 |