8001208JX by: AMD

UVPROM, 4KX8, 200ns, NMOS, 1.290 X 0.610 INCH, 0.225 INCH HEIGHT, DIP-24

Part Details for 8001208JX by AMD

Overview of 8001208JX by AMD

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Consumer Electronics Education and Research Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Electronic Manufacturing Renewable Energy Entertainment and Gaming Robotics and Drones

Part Details for 8001208JX

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8001208JX Part Data Attributes:

8001208JX AMD
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8001208JX AMD UVPROM, 4KX8, 200ns, NMOS, 1.290 X 0.610 INCH, 0.225 INCH HEIGHT, DIP-24
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP,
Pin Count 24
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 200 ns
JESD-30 Code R-XDIP-T24
Memory Density 32768 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 4096 words
Number of Words Code 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 4KX8
Package Body Material UNSPECIFIED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for 8001208JX

This table gives cross-reference parts and alternative options found for 8001208JX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 8001208JX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM2732B-205DI UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD 8001208JX vs AM2732B-205DI
TMS27C32-2JE 4KX8 UVPROM, 200ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments 8001208JX vs TMS27C32-2JE
AM2732B-200DC UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD 8001208JX vs AM2732B-200DC
TMS2732A-20JP4 4KX8 UVPROM, 200ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments 8001208JX vs TMS2732A-20JP4
TMS27C32-2JE4 4KX8 UVPROM, 200ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments 8001208JX vs TMS27C32-2JE4
QD2732A-20 UVPROM, 4KX8, 200ns, NMOS, CDIP24, CERDIP-24 Intel Corporation 8001208JX vs QD2732A-20
TMS27C32-2JL 4KX8 UVPROM, 200ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments 8001208JX vs TMS27C32-2JL
M2732A-2F6 4KX8 UVPROM, 200ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 STMicroelectronics 8001208JX vs M2732A-2F6
AM2732B-200DE UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD 8001208JX vs AM2732B-200DE
TMS27C32-20JL4 4KX8 UVPROM, 200ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments 8001208JX vs TMS27C32-20JL4
Part Number Description Manufacturer Compare
F353330S MASK ROM, 4KX8, 300ns, NMOS, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation 8001208JX vs F353330S
WS57C43B-55TMB UVPROM, 4KX8, 55ns, CMOS, CDIP24, Waferscale Integration Inc 8001208JX vs WS57C43B-55TMB
5962-9065803JX UVPROM, 4KX8, 45ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc 8001208JX vs 5962-9065803JX
AM27C43-35DC UVPROM, 4KX8, 35ns, CMOS, CDIP24, 0.300 INCH, SLIM, DIP-24 AMD 8001208JX vs AM27C43-35DC
HB23C32C-Y-000 MASK ROM, 4KX8, 1375ns, CMOS, CDIP24 Hughes Aircraft 8001208JX vs HB23C32C-Y-000
5962-9065804JA UVPROM, 4KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc 8001208JX vs 5962-9065804JA
NMC27C32BQE250 IC 4K X 8 UVPROM, 250 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation 8001208JX vs NMC27C32BQE250
WS57C43C-25T 4KX8 UVPROM, 25ns, CDIP24, 0.300 INCH, CERDIP-24 STMicroelectronics 8001208JX vs WS57C43C-25T
WS57C43B-45TMB UVPROM, 4KX8, 45ns, CMOS, CDIP24, Waferscale Integration Inc 8001208JX vs WS57C43B-45TMB
M2732A-25F1 4KX8 UVPROM, 250ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 STMicroelectronics 8001208JX vs M2732A-25F1

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