Part Details for 70T3339S200BCG by Integrated Device Technology Inc
Overview of 70T3339S200BCG by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (8 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 70T3339S200BCG | Renesas Electronics Corporation | 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's |
Part Details for 70T3339S200BCG
70T3339S200BCG CAD Models
70T3339S200BCG Part Data Attributes
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70T3339S200BCG
Integrated Device Technology Inc
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Datasheet
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70T3339S200BCG
Integrated Device Technology Inc
CABGA-256, Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | CABGA | |
| Package Description | 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | |
| Pin Count | 256 | |
| Manufacturer Package Code | BCG256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 3.4 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | S-CBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Memory Density | 9437184 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 256 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Standby Current-Max | 0.015 A | |
| Standby Voltage-Min | 2.4 V | |
| Supply Current-Max | 0.525 mA | |
| Supply Voltage-Max (Vsup) | 2.6 V | |
| Supply Voltage-Min (Vsup) | 2.4 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |
Alternate Parts for 70T3339S200BCG
This table gives cross-reference parts and alternative options found for 70T3339S200BCG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70T3339S200BCG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 70T3339S200BCG8 | Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70T3339S200BCG vs 70T3339S200BCG8 |
| IDT70T3339S200BC8 | Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70T3339S200BCG vs IDT70T3339S200BC8 |
| 70T3339S200BC | 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | 70T3339S200BCG vs 70T3339S200BC |
| 70T3339S200BCG | 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | 70T3339S200BCG vs 70T3339S200BCG |
| IDT70T3339S200BC | Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70T3339S200BCG vs IDT70T3339S200BC |
| IDT70T3339S200BCG | Dual-Port SRAM, 512KX18, 3.4ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70T3339S200BCG vs IDT70T3339S200BCG |
| IDT70T3339S200BCG8 | Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70T3339S200BCG vs IDT70T3339S200BCG8 |
| 70T3339S200BC8 | 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70T3339S200BCG vs 70T3339S200BC8 |