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Part Details for 70T3319S200BC by Renesas Electronics Corporation
Overview of 70T3319S200BC by Renesas Electronics Corporation
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (7 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Energy and Power Systems
Renewable Energy
Automotive
Price & Stock for 70T3319S200BC
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
70T3319S200BC-ND
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DigiKey | IC SRAM 4.5MBIT PAR 256CABGA Min Qty: 24 Lead time: 18 Weeks Container: Tray | Limited Supply - Call |
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$218.5492 | Buy Now |
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DISTI #
70T3319S200BC
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Avnet Americas | 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's - Trays (Alt: 70T3319S200BC) RoHS: Not Compliant Min Qty: 24 Package Multiple: 6 Container: Tray | 0 |
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$179.6669 / $205.1315 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 24 Package Multiple: 6 Lead time: 36 Weeks Container: Tray | 0Tray |
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$181.3800 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 24 Package Multiple: 6 Lead time: 36 Weeks Container: Tray | 0Tray |
|
$183.7300 | Buy Now |
Part Details for 70T3319S200BC
70T3319S200BC CAD Models
70T3319S200BC Part Data Attributes
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70T3319S200BC
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
70T3319S200BC
Renesas Electronics Corporation
256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | CABGA | |
| Pin Count | 256 | |
| Manufacturer Package Code | BC256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | NLR | |
| HTS Code | 8542320041 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 10 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Memory Density | 4718592 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 256 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Standby Current-Max | 0.015 A | |
| Standby Voltage-Min | 2.4 V | |
| Supply Current-Max | 0.525 mA | |
| Supply Voltage-Max (Vsup) | 2.6 V | |
| Supply Voltage-Min (Vsup) | 2.4 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 17 mm |
Alternate Parts for 70T3319S200BC
This table gives cross-reference parts and alternative options found for 70T3319S200BC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70T3319S200BC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDT70T3319S200BC8 | Dual-Port SRAM, 256KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70T3319S200BC vs IDT70T3319S200BC8 |
| IDT70T3319S200BCG8 | Dual-Port SRAM, 256KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70T3319S200BC vs IDT70T3319S200BCG8 |
| IDT70T3319S200BCG | Dual-Port SRAM, 256KX18, 3.4ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70T3319S200BC vs IDT70T3319S200BCG |
| 70T3319S200BC8 | CABGA-256, Reel | Integrated Device Technology Inc | 70T3319S200BC vs 70T3319S200BC8 |
| 70T3319S200BCG | Dual-Port SRAM, 256KX18, 3.4ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70T3319S200BC vs 70T3319S200BCG |
| IDT70T3319S200BC | Dual-Port SRAM, 256KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70T3319S200BC vs IDT70T3319S200BC |
| 70T3319S200BC8 | 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70T3319S200BC vs 70T3319S200BC8 |