Part Details for IDT70T3339S166BC8 by Integrated Device Technology Inc
Overview of IDT70T3339S166BC8 by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Electronic Manufacturing
Communication and Networking
Robotics and Drones
Part Details for IDT70T3339S166BC8
IDT70T3339S166BC8 CAD Models
IDT70T3339S166BC8 Part Data Attributes
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IDT70T3339S166BC8
Integrated Device Technology Inc
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Datasheet
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IDT70T3339S166BC8
Integrated Device Technology Inc
Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| kg CO2e/kg | 12 | |
| Average Weight (mg) | 914.1 | |
| CO2e (mg) | 10969.2 | |
| Total Weight | 914.6 | |
| Category CO2 Kg | 12 | |
| CO2 | 10975.2 | |
| Compliance Temperature Grade | Commercial: +0C to +70C | |
| Candidate List Date | 2024-01-23 | |
| SVHC Over MCV | 7439-92-1 | |
| CAS Accounted for Wt | 71 | |
| CA Prop 65 Presence | YES | |
| CA Prop 65 CAS Numbers | 7439-92-1 | |
| Conflict Mineral Status | DRC Conflict Free | |
| Conflict Mineral Status Source | CMRT V6.01 | |
| Access Time-Max | 12 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Memory Density | 9437184 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 256 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Standby Current-Max | 0.015 A | |
| Standby Voltage-Min | 2.4 V | |
| Supply Current-Max | 0.45 mA | |
| Supply Voltage-Max (Vsup) | 2.6 V | |
| Supply Voltage-Min (Vsup) | 2.4 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 17 mm |
Alternate Parts for IDT70T3339S166BC8
This table gives cross-reference parts and alternative options found for IDT70T3339S166BC8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT70T3339S166BC8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDT70T3339S166BC | Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | IDT70T3339S166BC8 vs IDT70T3339S166BC |
| 70T3339S166BC8 | 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | IDT70T3339S166BC8 vs 70T3339S166BC8 |
| 70T3339S166BCG | Dual-Port SRAM, 512KX18, 3.6ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | IDT70T3339S166BC8 vs 70T3339S166BCG |
| 70T3339S166BC | CABGA-256, Tray | Integrated Device Technology Inc | IDT70T3339S166BC8 vs 70T3339S166BC |
| 70T3339S166BCG8 | Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | IDT70T3339S166BC8 vs 70T3339S166BCG8 |