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Memory SRAMs 70T3339S200BCG

70T3339S200BCG
Description: 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray

Overview of 70T3339S200BCG by Renesas Electronics Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Computing and Data Storage

Available Datasheets

Part # Manufacturer Description Datasheet
70T3339S200BCG Renesas Electronics Corporation 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's

Price & Stock for 70T3339S200BCG by Renesas Electronics Corporation

Part # Manufacturer Description Stock Price Buy
DISTI # 70T3339S200BCG-ND
DigiKey IC SRAM 9MBIT PARALLEL 256CABGA Min Qty: 24 Lead time: 18 Weeks Container: Tray Temporarily Out of Stock
  • 24 $254.9762
$254.9762 Buy Now
DISTI # 70T3339S200BCG
Avnet Americas 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's - Trays (Alt: 70T3339S200BCG) RoHS: Compliant Min Qty: 24 Package Multiple: 6 Lead time: 18 Weeks, 0 Days Container: Tray 0
  • 1 $204.3000
$204.3000 Buy Now
DISTI # 972-70T3339S200BCG
Mouser Electronics SRAM 512K X 18 DP RoHS: Compliant 0
  • 1 $257.0100
  • 12 $253.0900
  • 30 $247.5300
$247.5300 / $257.0100 Order Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 24 Package Multiple: 6 Lead time: 18 Weeks Container: Tray 0
Tray
  • 24 $238.8000
$238.8000 Buy Now
DISTI # 70T3339S200BCG
Avnet Silica 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's (Alt: 70T3339S200BCG) RoHS: Compliant Min Qty: 6 Package Multiple: 6 Lead time: 19 Weeks, 0 Days Silica - 0
Buy Now

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Part Data Attributes for 70T3339S200BCG by Renesas Electronics Corporation
Parametric Data

70T3339S200BCG
Renesas Electronics Corporation
Buy Now
-
-
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Active
Ihs Manufacturer
RENESAS ELECTRONICS CORP
Part Package Code
CABGA
Package Description
17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256
Pin Count
256
Manufacturer Package Code
BCG256
Reach Compliance Code
compliant
ECCN Code
NLR
HTS Code
8542320041
Factory Lead Time
26 Weeks, 1 Day
Samacsys Manufacturer
Renesas Electronics
Access Time-Max
3.4 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
JESD-30 Code
S-CBGA-B256
JESD-609 Code
e1
Length
17 mm
Memory Density
9437184 bit
Memory IC Type
MULTI-PORT SRAM
Memory Width
18
Moisture Sensitivity Level
3
Number of Functions
1
Number of Ports
2
Number of Terminals
256
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
512KX18
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
LBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.7 mm
Standby Current-Max
0.015 A
Standby Voltage-Min
2.4 V
Supply Current-Max
0.525 mA
Supply Voltage-Max (Vsup)
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
17 mm
Want to compare parts?
  1. 70T3339S200BCG
    Renesas Electronics Corporation
    512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray
    VS

Alternate Parts for 70T3339S200BCG

This table gives cross-reference parts and alternative options found for 70T3339S200BCG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70T3339S200BCG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
70T3339S200BCG8 Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70T3339S200BCG vs 70T3339S200BCG8
70T3339S200BCG CABGA-256, Tray Integrated Device Technology Inc 70T3339S200BCG vs 70T3339S200BCG
IDT70T3339S200BC8 Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70T3339S200BCG vs IDT70T3339S200BC8
70T3339S200BC 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray Renesas Electronics Corporation 70T3339S200BCG vs 70T3339S200BC
IDT70T3339S200BC Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70T3339S200BCG vs IDT70T3339S200BC
IDT70T3339S200BCG Dual-Port SRAM, 512KX18, 3.4ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70T3339S200BCG vs IDT70T3339S200BCG
IDT70T3339S200BCG8 Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70T3339S200BCG vs IDT70T3339S200BCG8
70T3339S200BC8 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation 70T3339S200BCG vs 70T3339S200BC8
Part Number Description Manufacturer Compare
CYD09S18V18-167BBI Dual-Port SRAM, 512KX18, 11ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256 Cypress Semiconductor 70T3339S200BCG vs CYD09S18V18-167BBI
IDT70T3339S166BC8 Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70T3339S200BCG vs IDT70T3339S166BC8
IDT70T3339S200BC8 Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70T3339S200BCG vs IDT70T3339S200BC8
70V7319S166BC8 CABGA-256, Reel Integrated Device Technology Inc 70T3339S200BCG vs 70V7319S166BC8
IDT70V7339S166BC Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70T3339S200BCG vs IDT70V7339S166BC
70T3319S200BC 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray Renesas Electronics Corporation 70T3339S200BCG vs 70T3319S200BC
IDT70T3339S133BCGI Dual-Port SRAM, 512KX18, 4.2ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70T3339S200BCG vs IDT70T3339S133BCGI
70V7339S200BC8 CABGA-256, Reel Integrated Device Technology Inc 70T3339S200BCG vs 70V7339S200BC8
AS9C25512M2018L-166BI Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, BGA-256 Alliance Semiconductor Corporation 70T3339S200BCG vs AS9C25512M2018L-166BI
AS9C25256M2018L-250BC Dual-Port SRAM, 256KX18, 6.5ns, CMOS, PBGA256, BGA-256 Integrated Silicon Solution Inc 70T3339S200BCG vs AS9C25256M2018L-250BC

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