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Memory SRAMs 70T3319S200BC8

70T3319S200BC8
Description: 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel

Overview of 70T3319S200BC8 by Renesas Electronics Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Consumer Electronics Energy and Power Systems Renewable Energy Automotive

Price & Stock for 70T3319S200BC8 by Renesas Electronics Corporation

Part # Manufacturer Description Stock Price Buy
DISTI # 70T3319S200BC8-ND
DigiKey IC SRAM 4.5MBIT PAR 256CABGA Min Qty: 1000 Lead time: 18 Weeks Container: Tape & Reel (TR) Limited Supply - Call
  • 1,000 $182.1426
$182.1426 Buy Now
DISTI # 70T3319S200BC8
Avnet Americas 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's - Tape and Reel (Alt: 70T3319S200BC8) RoHS: Not Compliant Min Qty: 1000 Package Multiple: 1000 Container: Reel 0
  • 1,000 $205.1315
  • 2,000 $200.8874
  • 4,000 $196.6433
  • 6,000 $192.3992
  • 8,000 $188.1551
  • 10,000 $183.9110
  • 100,000 $179.6669
$179.6669 / $205.1315 Buy Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Lead time: 36 Weeks Container: Reel 0
Reel
  • 1,000 $181.3800
$181.3800 Buy Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Lead time: 36 Weeks Container: Reel 0
Reel
  • 1,000 $183.7300
$183.7300 Buy Now

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Part Data Attributes for 70T3319S200BC8 by Renesas Electronics Corporation
Parametric Data

70T3319S200BC8
Renesas Electronics Corporation
Buy Now
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
End Of Life
Ihs Manufacturer
RENESAS ELECTRONICS CORP
Part Package Code
CABGA
Pin Count
256
Manufacturer Package Code
BC256
Reach Compliance Code
not_compliant
ECCN Code
NLR
HTS Code
8542320041
Samacsys Manufacturer
Renesas Electronics
Access Time-Max
10 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
JESD-30 Code
S-PBGA-B256
JESD-609 Code
e0
Length
17 mm
Memory Density
4718592 bit
Memory IC Type
MULTI-PORT SRAM
Memory Width
18
Moisture Sensitivity Level
3
Number of Functions
1
Number of Ports
2
Number of Terminals
256
Number of Words
262144 words
Number of Words Code
256000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
256KX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Seated Height-Max
1.5 mm
Standby Current-Max
0.015 A
Standby Voltage-Min
2.4 V
Supply Current-Max
0.525 mA
Supply Voltage-Max (Vsup)
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
17 mm
Want to compare parts?
  1. 70T3319S200BC8
    Renesas Electronics Corporation
    256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel
    VS

Alternate Parts for 70T3319S200BC8

This table gives cross-reference parts and alternative options found for 70T3319S200BC8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70T3319S200BC8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
IDT70T3319S200BC8 Dual-Port SRAM, 256KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70T3319S200BC8 vs IDT70T3319S200BC8
IDT70T3319S200BCG8 Dual-Port SRAM, 256KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70T3319S200BC8 vs IDT70T3319S200BCG8
IDT70T3319S200BCG Dual-Port SRAM, 256KX18, 3.4ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70T3319S200BC8 vs IDT70T3319S200BCG
70T3319S200BC8 CABGA-256, Reel Integrated Device Technology Inc 70T3319S200BC8 vs 70T3319S200BC8
70T3319S200BCG Dual-Port SRAM, 256KX18, 3.4ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70T3319S200BC8 vs 70T3319S200BCG
IDT70T3319S200BC Dual-Port SRAM, 256KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70T3319S200BC8 vs IDT70T3319S200BC
70T3319S200BC 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray Renesas Electronics Corporation 70T3319S200BC8 vs 70T3319S200BC
Part Number Description Manufacturer Compare
70V7339S200BC8 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA0/Reel Renesas Electronics Corporation 70T3319S200BC8 vs 70V7339S200BC8
70V7339S133BC8 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA0/Reel Renesas Electronics Corporation 70T3319S200BC8 vs 70V7339S133BC8
IDT70T633S15BCG Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HIEGHT, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70T3319S200BC8 vs IDT70T633S15BCG
70V7339S166BCI 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA90/Tray Renesas Electronics Corporation 70T3319S200BC8 vs 70V7339S166BCI
IDT70V7339S133BC8 Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70T3319S200BC8 vs IDT70V7339S133BC8
70T633S10BC8 512K x 18, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation 70T3319S200BC8 vs 70T633S10BC8
70T633S10BCI8 512K x 18, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation 70T3319S200BC8 vs 70T633S10BCI8
70T633S10BCI8 CABGA-256, Reel Integrated Device Technology Inc 70T3319S200BC8 vs 70T633S10BCI8
70T633S8BCG Dual-Port SRAM, 512KX18, 8ns, CMOS, PBGA256, 17 X 17 MM, 1.40 HEIGHT, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70T3319S200BC8 vs 70T633S8BCG
IDT70T633S12BCG Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HIEGHT, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70T3319S200BC8 vs IDT70T633S12BCG

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