Part Details for 6167LA25EB by Integrated Device Technology Inc
Overview of 6167LA25EB by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Audio and Video Systems
Part Details for 6167LA25EB
6167LA25EB CAD Models
6167LA25EB Part Data Attributes
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6167LA25EB
Integrated Device Technology Inc
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Datasheet
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6167LA25EB
Integrated Device Technology Inc
Standard SRAM, 16KX1, 25ns, CMOS, CDFP20, 0.300 INCH, CERAMIC, PACKAGE-20
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Package Description | 0.300 INCH, CERAMIC, PACKAGE-20 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 25 ns | |
I/O Type | SEPARATE | |
JESD-30 Code | R-CDFP-F20 | |
JESD-609 Code | e0 | |
Memory Density | 16384 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 1 | |
Number of Functions | 1 | |
Number of Terminals | 20 | |
Number of Words | 16384 words | |
Number of Words Code | 16000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 16KX1 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DFP | |
Package Equivalence Code | FL20,.3 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Screening Level | MIL-STD-883 Class B | |
Standby Current-Max | 0.0002 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.075 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | FLAT | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL |
Alternate Parts for 6167LA25EB
This table gives cross-reference parts and alternative options found for 6167LA25EB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 6167LA25EB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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8413206SA | Standard SRAM, 4KX1, 120ns, CMOS, CDIP18, | Pyramid Semiconductor Corporation | 6167LA25EB vs 8413206SA |
6167LA25FB | Standard SRAM, 16KX1, 25ns, CMOS, CDFP20 | Integrated Device Technology Inc | 6167LA25EB vs 6167LA25FB |