Memory
5962-9318707H4X
Description: SRAM Module, 128KX32, 35ns, CMOS, CHIP66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66

Overview of 5962-9318707H4X by Cobham Semiconductor Solutions

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

CAD Models for 5962-9318707H4X by Cobham Semiconductor Solutions
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Part Data Attributes for 5962-9318707H4X by Cobham Semiconductor Solutions

5962-9318707H4X
Cobham Semiconductor Solutions
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
AEROFLEX COLORADO SPRINGS
Part Package Code
PGA
Package Description
,
Pin Count
66
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
35 ns
Additional Feature
USER CONFIGURABLE AS 512K X 8
Alternate Memory Width
16
JESD-30 Code
S-CHIP-P66
Memory Density
4194304 bit
Memory IC Type
SRAM MODULE
Memory Width
32
Number of Functions
1
Number of Terminals
66
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
128KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Shape
SQUARE
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-PRF-38535
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
PIN/PEG
Terminal Position
HEX
Want to compare parts?
  1. 5962-9318707H4X
    Cobham Semiconductor Solutions
    SRAM Module, 128KX32, 35ns, CMOS, CHIP66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66
    VS

Alternate Parts for 5962-9318707H4X

This table gives cross-reference parts and alternative options found for 5962-9318707H4X. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9318707H4X, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
FTS128K32N-35H1M Standard SRAM, 128KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SHIELD, CERAMIC, PGA-66 Force Technologies Ltd 5962-9318707H4X vs FTS128K32N-35H1M
5962-9318707H4A SRAM Module, 128KX32, 35ns, CMOS, CHIP66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66 White Microelectronics 5962-9318707H4X vs 5962-9318707H4A
WS128K32N-35H1I SRAM Module, 128KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc 5962-9318707H4X vs WS128K32N-35H1I
WS128K32N-35HQ SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp 5962-9318707H4X vs WS128K32N-35HQ
FTS128K32N-35H1CA Standard SRAM, 128KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SHIELD, CERAMIC, PGA-66 Force Technologies Ltd 5962-9318707H4X vs FTS128K32N-35H1CA
5962-9318707H4X SRAM Module, 128KX32, 35ns, CMOS, CHIP66, HERMETIC SEALED, CERAMIC, HIP-66 White Microelectronics 5962-9318707H4X vs 5962-9318707H4X
5962-9318707H4A SRAM Module, 128KX32, 35ns, CMOS, CPGA66 Cobham Advanced Electronic Solutions 5962-9318707H4X vs 5962-9318707H4A
WS128K32N-35HC SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp 5962-9318707H4X vs WS128K32N-35HC
WS128K32N-35H1M SRAM Module, 128KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc 5962-9318707H4X vs WS128K32N-35H1M
WS128K32N-35H1IA SRAM Module, 128KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc 5962-9318707H4X vs WS128K32N-35H1IA
Part Number Description Manufacturer Compare
P4C164-35DM Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Pyramid Semiconductor Corporation 5962-9318707H4X vs P4C164-35DM
P4C164-35DWC Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Pyramid Semiconductor Corporation 5962-9318707H4X vs P4C164-35DWC
P4C164-35DWMB Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Pyramid Semiconductor Corporation 5962-9318707H4X vs P4C164-35DWMB
MT5C2568F-15L/XT Standard SRAM, 32KX8, 15ns, CMOS, CDFP28, CERAMIC, DFP-28 Micross Components 5962-9318707H4X vs MT5C2568F-15L/XT
HM3-65764H-5 Standard SRAM, 8KX8, 25ns, CMOS, PDIP28, Temic Semiconductors 5962-9318707H4X vs HM3-65764H-5
5962-9461106HMC Cache SRAM Module, 512KX32, 45ns, CMOS, CQFP68, METAL,CO-FIRED CERAMIC, SINGLE/DUAL CAVITY, QFP-68 Mercury Systems Inc 5962-9318707H4X vs 5962-9461106HMC
5962-9559515HNX SRAM Module, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 Mercury Systems Inc 5962-9318707H4X vs 5962-9559515HNX
5962-8552508XX Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Integrated Device Technology Inc 5962-9318707H4X vs 5962-8552508XX
MT5C2568C-20L/XT Standard SRAM, 32KX8, 20ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Micross Components 5962-9318707H4X vs MT5C2568C-20L/XT
P4C164L-35PMLF Standard SRAM, 8KX8, 35ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Pyramid Semiconductor Corporation 5962-9318707H4X vs P4C164L-35PMLF

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