Findchips: Parametric Search Results for 5962-9318707H4X


Select Parts		Part Number

		5962-9318707H4X White Microelectronics
		5962-9318707H4X White Electronic Designs Corp
		5962-9318707H4X Mercury Systems Inc
		5962-9318707H4X Cobham Power Products
		5962-9318707H4X Micross Components
		5962-9318707H4X Microsemi Corporation
		5962-9318707H4X Cobham Semiconductor Solutions

				Most Relevant					Technical												Compliance		Operating Conditions					Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Obsolete

4.1943 Mbit

128KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CHIP-P66

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

SQUARE

IN-LINE

PIN/PEG

HEX

WHITE MICROELECTRONICS

HERMETIC SEALED, CERAMIC, HIP-66

unknown

3A001.A.2.C

8542.32.00.41

Check for Price

Transferred

4.1943 Mbit

128KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CPGA-P66

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

MIL-STD-883

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

PIN/PEG

2.54 mm

PERPENDICULAR

4.6 mm

27.3 mm

WHITE ELECTRONIC DESIGNS CORP

1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

unknown

3A001.A.2.C

8542.32.00.41

Check for Price

Active

4.1943 Mbit

128KX32

5 V

35 ns

SRAM MODULE

ALSO CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CPGA-P66

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

PIN/PEG

2.54 mm

PERPENDICULAR

4.6 mm

27.3 mm

MERCURY SYSTEMS INC

PGA,

unknown

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

4.1943 Mbit

128KX32

5 V

35 ns

CACHE SRAM MODULE

CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CPGA-P66

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

PIN/PEG

2.54 mm

PERPENDICULAR

4.699 mm

AEROFLEX PLAINVIEW

PGA,

unknown

3A001.A.2.C

8542.32.00.41

PGA

Check for Price

Active

4.1943 Mbit

128KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CHIP-P66

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B (Modified)

CERAMIC, METAL-SEALED COFIRED

SQUARE

IN-LINE

PIN/PEG

HEX

MICROSS COMPONENTS

compliant

3A001.A.2.C

8542.32.00.41

PGA

Check for Price

Transferred

4.1943 Mbit

128KX32

5 V

35 ns

SRAM MODULE

ALSO CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CPGA-P66

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

PIN/PEG

2.54 mm

PERPENDICULAR

4.6 mm

27.3 mm

MICROSEMI CORP

PGA,

unknown

3A001.A.2.C

8542.32.00.41

PGA

Check for Price

Obsolete

4.1943 Mbit

128KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CHIP-P66

Not Qualified

125 °C

-55 °C

MIL-PRF-38535

CERAMIC, METAL-SEALED COFIRED

SQUARE

IN-LINE

PIN/PEG

HEX

AEROFLEX COLORADO SPRINGS

unknown

3A001.A.2.C

8542.32.00.41

PGA

Compare

5962-9318707H4X

White Microelectronics

Check for Price

Obsolete

4.1943 Mbit

128KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CHIP-P66

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

SQUARE

IN-LINE

PIN/PEG

HEX

WHITE MICROELECTRONICS

HERMETIC SEALED, CERAMIC, HIP-66

unknown

3A001.A.2.C

8542.32.00.41

5962-9318707H4X

White Electronic Designs Corp

Check for Price

Transferred

4.1943 Mbit

128KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CPGA-P66

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

MIL-STD-883

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

PIN/PEG

2.54 mm

PERPENDICULAR

4.6 mm

27.3 mm

WHITE ELECTRONIC DESIGNS CORP

1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

unknown

3A001.A.2.C

8542.32.00.41

5962-9318707H4X

Mercury Systems Inc

Check for Price

Active

4.1943 Mbit

128KX32

5 V

35 ns

SRAM MODULE

ALSO CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CPGA-P66

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

PIN/PEG

2.54 mm

PERPENDICULAR

4.6 mm

27.3 mm

MERCURY SYSTEMS INC

PGA,

unknown

3A001.A.2.C

8542.32.00.41

5962-9318707H4X

Cobham Power Products

Check for Price

Obsolete

4.1943 Mbit

128KX32

5 V

35 ns

CACHE SRAM MODULE

CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CPGA-P66

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

PIN/PEG

2.54 mm

PERPENDICULAR

4.699 mm

AEROFLEX PLAINVIEW

PGA,

unknown

3A001.A.2.C

8542.32.00.41

PGA

5962-9318707H4X

Micross Components

Check for Price

Active

4.1943 Mbit

128KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CHIP-P66

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B (Modified)

CERAMIC, METAL-SEALED COFIRED

SQUARE

IN-LINE

PIN/PEG

HEX

MICROSS COMPONENTS

compliant

3A001.A.2.C

8542.32.00.41

PGA

5962-9318707H4X

Microsemi Corporation

Check for Price

Transferred

4.1943 Mbit

128KX32

5 V

35 ns

SRAM MODULE

ALSO CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CPGA-P66

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

PIN/PEG

2.54 mm

PERPENDICULAR

4.6 mm

27.3 mm

MICROSEMI CORP

PGA,

unknown

3A001.A.2.C

8542.32.00.41

PGA

5962-9318707H4X

Cobham Semiconductor Solutions

Check for Price

Obsolete

4.1943 Mbit

128KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 512K X 8

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CHIP-P66

Not Qualified

125 °C

-55 °C

MIL-PRF-38535

CERAMIC, METAL-SEALED COFIRED

SQUARE

IN-LINE

PIN/PEG

HEX

AEROFLEX COLORADO SPRINGS

unknown

3A001.A.2.C

8542.32.00.41

PGA

Parametric results for: 5962-9318707H4X under SRAMs