Datasheets
5962-9318707H4X by:

SRAM Module, 128KX32, 35ns, CMOS, CHIP66, HERMETIC SEALED, CERAMIC, HIP-66

Part Details for 5962-9318707H4X by White Microelectronics

Overview of 5962-9318707H4X by White Microelectronics

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Part Details for 5962-9318707H4X

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5962-9318707H4X Part Data Attributes:

5962-9318707H4X White Microelectronics
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5962-9318707H4X White Microelectronics SRAM Module, 128KX32, 35ns, CMOS, CHIP66, HERMETIC SEALED, CERAMIC, HIP-66
Part Life Cycle Code Obsolete
Ihs Manufacturer WHITE MICROELECTRONICS
Package Description HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 35 ns
Additional Feature USER CONFIGURABLE AS 512K X 8
Alternate Memory Width 16
JESD-30 Code S-CHIP-P66
Memory Density 4194304 bit
Memory IC Type SRAM MODULE
Memory Width 32
Number of Functions 1
Number of Terminals 66
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Shape SQUARE
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form PIN/PEG
Terminal Position HEX

Alternate Parts for 5962-9318707H4X

This table gives cross-reference parts and alternative options found for 5962-9318707H4X. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9318707H4X, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-9318707H4X Cache SRAM Module, 128KX32, 35ns, CMOS, CPGA66, 1.085 X 1.085 INCH, 0.160 INCH HEIGHT, HERMETIC SEALED, PGA-66 Cobham Power Products 5962-9318707H4X vs 5962-9318707H4X
5962-9318707H4C SRAM Module, 128KX32, 35ns, CMOS, CPGA66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66 Mercury Systems Inc 5962-9318707H4X vs 5962-9318707H4C
FTS128K32N-35H1I Standard SRAM, 128KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SHIELD, CERAMIC, PGA-66 Force Technologies Ltd 5962-9318707H4X vs FTS128K32N-35H1I
FTS128K32N-35H1CA Standard SRAM, 128KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SHIELD, CERAMIC, PGA-66 Force Technologies Ltd 5962-9318707H4X vs FTS128K32N-35H1CA
WS128K32N-35H1IA SRAM Module, 128KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc 5962-9318707H4X vs WS128K32N-35H1IA
WS128K32N-35HM SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp 5962-9318707H4X vs WS128K32N-35HM
WS128K32N-35HSCE SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp 5962-9318707H4X vs WS128K32N-35HSCE
FTS128K32N-35H1Q Standard SRAM, 128KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SHIELD, CERAMIC, PGA-66 Force Technologies Ltd 5962-9318707H4X vs FTS128K32N-35H1Q
WS128K32N-35HC SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp 5962-9318707H4X vs WS128K32N-35HC
FTS128K32N-35H1M Standard SRAM, 128KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SHIELD, CERAMIC, PGA-66 Force Technologies Ltd 5962-9318707H4X vs FTS128K32N-35H1M
Part Number Description Manufacturer Compare
5962-8685918XA Standard SRAM, 16KX4, 35ns, CMOS, CQCC28, LCC-28 Integrated Device Technology Inc 5962-9318707H4X vs 5962-8685918XA
P4C164L-12FMBLF Standard SRAM, 8KX8, 12ns, CMOS, CDFP28, ROHS COMPLIANT, CERAMIC, DFP-28 Pyramid Semiconductor Corporation 5962-9318707H4X vs P4C164L-12FMBLF
P4C164L-12FM Standard SRAM, 8KX8, 12ns, CMOS, CDFP28, CERAMIC, DFP-28 Pyramid Semiconductor Corporation 5962-9318707H4X vs P4C164L-12FM
5962-9559514HNC SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 Micross Components 5962-9318707H4X vs 5962-9559514HNC
P4C164-35CWMBLF Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation 5962-9318707H4X vs P4C164-35CWMBLF
5962-9559507HNC SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 Mercury Systems Inc 5962-9318707H4X vs 5962-9559507HNC
FT6164L-35DMBLF Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERDIP-28 Force Technologies Ltd 5962-9318707H4X vs FT6164L-35DMBLF
FT6264L-35DWMLF Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 Force Technologies Ltd 5962-9318707H4X vs FT6264L-35DWMLF
5962-9559508H9C SRAM Module, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 White Microelectronics 5962-9318707H4X vs 5962-9559508H9C
5962-9559514HNA SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 Mercury Systems Inc 5962-9318707H4X vs 5962-9559514HNA

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