Part Details for 53S881N by AMD
Overview of 53S881N by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (8 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 53S881N
53S881N CAD Models
53S881N Part Data Attributes
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53S881N
AMD
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Datasheet
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53S881N
AMD
OTP ROM, 1KX8, 55ns, Bipolar, PDIP24, SKINNY, PLASTIC, DIP-24
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 25 ns | |
| JESD-30 Code | R-PDIP-T24 | |
| Length | 32.004 mm | |
| Memory Density | 256 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 1024 words | |
| Number of Words Code | 32 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32X8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.715 mm | |
| Supply Current-Max | 0.16 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 53S881N
This table gives cross-reference parts and alternative options found for 53S881N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 53S881N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DM87S181J | IC 1K X 8 OTPROM, 55 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM | National Semiconductor Corporation | 53S881N vs DM87S181J |
| DM87S280N | IC 1K X 8 OTPROM, 55 ns, PDIP24, PLASTIC, DIP-24, Programmable ROM | National Semiconductor Corporation | 53S881N vs DM87S280N |
| DM87S181J | 1KX8 OTPROM, 55ns, CDIP24, CERAMIC, DIP-24 | Texas Instruments | 53S881N vs DM87S181J |
| MB7132EWZ | OTP ROM, 1KX8, 55ns, Bipolar, CDIP24, CERDIP-24 | FUJITSU Semiconductor Limited | 53S881N vs MB7132EWZ |
| MB7132EWZ | 1KX8 OTPROM, 55ns, CDIP24, CERDIP-24 | FUJITSU Limited | 53S881N vs MB7132EWZ |
| 53S881J | OTP ROM, 1KX8, 55ns, TTL, CDIP24, | AMD | 53S881N vs 53S881J |
| DM87S181N | IC 1K X 8 OTPROM, 55 ns, PDIP24, PLASTIC, DIP-24, Programmable ROM | Texas Instruments | 53S881N vs DM87S181N |
| DM87S180J | IC 1K X 8 OTPROM, 55 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM | National Semiconductor Corporation | 53S881N vs DM87S180J |