Part Details for AM27S37DCB by AMD
Overview of AM27S37DCB by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for AM27S37DCB
AM27S37DCB CAD Models
AM27S37DCB Part Data Attributes
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AM27S37DCB
AMD
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Datasheet
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AM27S37DCB
AMD
OTP ROM, 1KX8, Bipolar, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP24,.3 | |
Pin Count | 24 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 60 ns | |
JESD-30 Code | R-GDIP-T24 | |
JESD-609 Code | e0 | |
Length | 31.9405 mm | |
Memory Density | 1024 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 4 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 1024 words | |
Number of Words Code | 256 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | ||
Organization | 256X4 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Supply Current-Max | 0.185 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | BIPOLAR | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |
Alternate Parts for AM27S37DCB
This table gives cross-reference parts and alternative options found for AM27S37DCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S37DCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM27S37/BLA | OTP ROM, 1KX8, Bipolar, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | AMD | AM27S37DCB vs AM27S37/BLA |
53RS881AJS | OTP ROM, 1KX8, 30ns, CMOS, CDIP24, | Monolithic Memories (RETIRED) | AM27S37DCB vs 53RS881AJS |
AM27S37ADC | OTP ROM, 1KX8, Bipolar, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | AMD | AM27S37DCB vs AM27S37ADC |
AM27S37PCB | OTP ROM, 1KX8, Bipolar, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | AMD | AM27S37DCB vs AM27S37PCB |
53RS881JS | OTP ROM, 1KX8, 35ns, CMOS, CDIP24, | Monolithic Memories (RETIRED) | AM27S37DCB vs 53RS881JS |
53RS881JS | OTP ROM, 1KX8, 35ns, CMOS, CDIP24, | AMD | AM27S37DCB vs 53RS881JS |
AM27S37DC | OTP ROM, 1KX8, Bipolar, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | AMD | AM27S37DCB vs AM27S37DC |