Part Details for 27HC256-90E/K by Microchip Technology Inc
Overview of 27HC256-90E/K by Microchip Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for 27HC256-90E/K
27HC256-90E/K CAD Models
27HC256-90E/K Part Data Attributes
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27HC256-90E/K
Microchip Technology Inc
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Datasheet
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27HC256-90E/K
Microchip Technology Inc
32K X 8 UVPROM, 90 ns, CQCC32, CERAMIC, LCC-32
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Part Package Code | QFJ | |
| Package Description | CERAMIC, LCC-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 90 ns | |
| JESD-30 Code | R-CQCC-N32 | |
| Memory Density | 262144 bit | |
| Memory IC Type | EPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QCCN | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 0.055 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | NO LEAD | |
| Terminal Position | QUAD |
Alternate Parts for 27HC256-90E/K
This table gives cross-reference parts and alternative options found for 27HC256-90E/K. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27HC256-90E/K, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8606317YX | UVPROM, 32KX8, 90ns, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | 27HC256-90E/K vs 5962-8606317YX |
| 27HC256L-90/K | 32K X 8 UVPROM, 90 ns, CQCC32, CERAMIC, LCC-32 | Microchip Technology Inc | 27HC256-90E/K vs 27HC256L-90/K |
| 5662-860637YC | UVPROM, 32KX8, 90ns, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | 27HC256-90E/K vs 5662-860637YC |
| 5962-8606307YC | UVPROM, 32KX8, 90ns, CMOS, CQCC32, | Teledyne e2v | 27HC256-90E/K vs 5962-8606307YC |
| AM27C256-90LCB | UVPROM, 32KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | 27HC256-90E/K vs AM27C256-90LCB |
| 5962-8606307YC | UVPROM, 32KX8, 90ns, CMOS, CQCC32, | Waferscale Integration Inc | 27HC256-90E/K vs 5962-8606307YC |
| AM27C256-95LIB | UVPROM, 32KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | 27HC256-90E/K vs AM27C256-95LIB |
| 5962-8606317YX | UVPROM, 32KX8, 90ns, CMOS, CQCC32, CERAMIC, LCC-32 | Micross Components | 27HC256-90E/K vs 5962-8606317YX |
| 5962-8606307YA | UVPROM, 32KX8, 90ns, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 | Micross Components | 27HC256-90E/K vs 5962-8606307YA |
| CY27C256A-90QMB | UVPROM, 32KX8, 90ns, CMOS, CQCC32, HERMETIC SEALED, WINDOWED, LCC-32 | Cypress Semiconductor | 27HC256-90E/K vs CY27C256A-90QMB |