27HC256-90E/K vs 27HC256L-90/K feature comparison

27HC256-90E/K Microchip Technology Inc

Buy Now Datasheet

27HC256L-90/K Microchip Technology Inc

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code QFJ QFJ
Package Description CERAMIC, LCC-32 CERAMIC, LCC-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 90 ns 90 ns
JESD-30 Code R-CQCC-N32 R-CQCC-N32
Memory Density 262144 bit 262144 bit
Memory IC Type EPROM EPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.055 mA 0.055 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position QUAD QUAD
Base Number Matches 1 1
Output Characteristics 3-STATE

Compare 27HC256-90E/K with alternatives

Compare 27HC256L-90/K with alternatives