There are no models available for this part yet.
Overview of 11LC160-I/MNY by Microchip Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 4 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for 11LC160-I/MNY by Microchip Technology Inc
Part Data Attributes for 11LC160-I/MNY by Microchip Technology Inc
|
|
---|---|
Pbfree Code
|
Yes
|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code
|
DFN
|
Package Description
|
2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8
|
Pin Count
|
8
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.51
|
Clock Frequency-Max (fCLK)
|
1 MHz
|
JESD-30 Code
|
R-PDSO-N8
|
JESD-609 Code
|
e4
|
Length
|
3 mm
|
Memory Density
|
16384 bit
|
Memory IC Type
|
EEPROM
|
Memory Width
|
8
|
Moisture Sensitivity Level
|
1
|
Number of Functions
|
1
|
Number of Terminals
|
8
|
Number of Words
|
2048 words
|
Number of Words Code
|
2000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
2KX8
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
HVSON
|
Package Shape
|
RECTANGULAR
|
Package Style
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Parallel/Serial
|
SERIAL
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Screening Level
|
AEC-Q100
|
Seated Height-Max
|
0.8 mm
|
Serial Bus Type
|
1-WIRE
|
Supply Current-Max
|
0.005 mA
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
Supply Voltage-Min (Vsup)
|
2.5 V
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form
|
NO LEAD
|
Terminal Pitch
|
0.5 mm
|
Terminal Position
|
DUAL
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
Width
|
2 mm
|
Write Cycle Time-Max (tWC)
|
10 ms
|
Alternate Parts for 11LC160-I/MNY
This table gives cross-reference parts and alternative options found for 11LC160-I/MNY. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 11LC160-I/MNY, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
11AA160-I/MNY | 2K X 8 1-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | Microchip Technology Inc | 11LC160-I/MNY vs 11AA160-I/MNY |
11LC160-E/MN | 2K X 8 1-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | Microchip Technology Inc | 11LC160-I/MNY vs 11LC160-E/MN |
11LC160T-I/MN | 2K X 8 1-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | Microchip Technology Inc | 11LC160-I/MNY vs 11LC160T-I/MN |
11LC160T-E/MNY | 2K X 8 1-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | Microchip Technology Inc | 11LC160-I/MNY vs 11LC160T-E/MNY |