11LC160-I/MNY
vs
BR24S64FVJ-WE2
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ROHM CO LTD
|
| Part Package Code |
DFN
|
SOIC
|
| Package Description |
2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8
|
ROHS COMPLIANT, TSSOP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
1 MHz
|
0.4 MHz
|
| JESD-30 Code |
R-PDSO-N8
|
S-PDSO-G8
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
3 mm
|
| Memory Density |
16384 bit
|
65536 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
2048 words
|
8192 words
|
| Number of Words Code |
2000
|
8000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2KX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
0.8 mm
|
1.1 mm
|
| Serial Bus Type |
1-WIRE
|
I2C
|
| Supply Current-Max |
0.005 mA
|
0.002 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Width |
2 mm
|
3 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
5 ms
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
ROHM Semiconductor
|
| Data Retention Time-Min |
|
40
|
| Endurance |
|
1000000 Write/Erase Cycles
|
| I2C Control Byte |
|
1010DDDR
|
| Package Equivalence Code |
|
TSSOP8,.19
|
| Standby Current-Max |
|
0.000002 A
|
| Write Protection |
|
HARDWARE
|
|
|
|
Compare 11LC160-I/MNY with alternatives
Compare BR24S64FVJ-WE2 with alternatives