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XC4062XLA-08BGG432I vs XC4062XLA-09BG432C feature comparison

XC4062XLA-08BGG432I AMD Xilinx

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XC4062XLA-09BG432C AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, PLASTIC, BGA-432
Pin Count 432 432
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 130000 GATES CAN ALSO USE 130000 GATES
Clock Frequency-Max 263 MHz 227 MHz
Combinatorial Delay of a CLB-Max 1 ns 1.1 ns
JESD-30 Code S-PBGA-B432 S-PBGA-B432
JESD-609 Code e1 e0
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2304 2304
Number of Equivalent Gates 40000 40000
Number of Inputs 352 384
Number of Outputs 352 384
Number of Terminals 432 432
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2304 CLBS, 40000 GATES 2304 CLBS, 40000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA432,31X31,50 BGA432,31X31,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 40 mm
Base Number Matches 1 1
Number of Logic Cells 2304
Temperature Grade OTHER
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

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