XC4062XLA-09BG432C vs XC4062XL-2BG432I feature comparison

XC4062XLA-09BG432C AMD Xilinx

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XC4062XL-2BG432I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-432 PLASTIC, BGA-432
Pin Count 432 432
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 130000 GATES MAX USABLE 62000 LOGIC GATES
Clock Frequency-Max 227 MHz 179 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.5 ns
JESD-30 Code S-PBGA-B432 S-PBGA-B432
JESD-609 Code e0 e0
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2304 2304
Number of Equivalent Gates 40000 40000
Number of Inputs 384 352
Number of Logic Cells 2304 2304
Number of Outputs 384 352
Number of Terminals 432 432
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 2304 CLBS, 40000 GATES 2304 CLBS, 40000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA432,31X31,50 BGA432,31X31,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 40 mm
Base Number Matches 1 1

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