X84128ZE-2.5
vs
IS24C128-2BI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
IC MICROSYSTEMS SDN BHD
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
BGA
Package Description
VBGA,
BGA-8
Pin Count
8
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
5 MHz
0.1 MHz
JESD-30 Code
R-XBGA-B8
R-PBGA-B8
JESD-609 Code
e0
e0
Length
6.046 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-20 °C
-40 °C
Organization
16KX8
16KX8
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VBGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE
GRID ARRAY
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.62 mm
Serial Bus Type
3-WIRE
I2C
Supply Current-Max
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
1.8 V
Supply Voltage-Nom (Vsup)
3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.5 mm
Terminal Position
BOTTOM
BOTTOM
Width
1.982 mm
Write Cycle Time-Max (tWC)
5 ms
10 ms
Base Number Matches
1
1
Compare X84128ZE-2.5 with alternatives
Compare IS24C128-2BI with alternatives