IS24C128-2BI
vs
X84128ZI-2.5
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
XICOR INC
Part Package Code
BGA
Package Description
BGA-8
XBGA-8
Pin Count
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Clock Frequency-Max (fCLK)
0.1 MHz
JESD-30 Code
R-PBGA-B8
R-XBGA-B8
JESD-609 Code
e0
Memory Density
131072 bit
131072 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16KX8
16KX8
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
BGA
VBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Serial Bus Type
I2C
3-WIRE
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
2.5 V
Supply Voltage-Nom (Vsup)
2.5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Write Cycle Time-Max (tWC)
10 ms
5 ms
Base Number Matches
1
2
Length
6.046 mm
Seated Height-Max
0.62 mm
Terminal Pitch
1.5 mm
Width
1.982 mm
Compare IS24C128-2BI with alternatives
Compare X84128ZI-2.5 with alternatives