X24C16PMB vs X24C16DI feature comparison

X24C16PMB IC Microsystems Sdn Bhd

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X24C16DI Xicor Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IC MICROSYSTEMS SDN BHD XICOR INC
Part Package Code DIP
Package Description DIP, DIP8,.3 CERDIP-8
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 0.1 MHz 0.1 MHz
Data Retention Time-Min 100 100
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
I2C Control Byte 1010MMMR 1010MMMR
JESD-30 Code R-PDIP-T8 R-GDIP-T8
Length 10.03 mm
Memory Density 16384 bit 16384 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 2KX8 2KX8
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 4.32 mm 5.08 mm
Serial Bus Type I2C I2C
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.003 mA 0.003 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 8 5
Additional Feature 2 WIRE INTERFACE;PAGE WRITE
JESD-609 Code e0
Terminal Finish TIN LEAD

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