X24C16DI
vs
X24C16PMG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
IC MICROSYSTEMS SDN BHD
Package Description
CERDIP-8
DIP,
Reach Compliance Code
unknown
unknown
Additional Feature
2 WIRE INTERFACE;PAGE WRITE
Clock Frequency-Max (fCLK)
0.1 MHz
0.1 MHz
Data Retention Time-Min
100
Endurance
100000 Write/Erase Cycles
I2C Control Byte
1010MMMR
JESD-30 Code
R-GDIP-T8
R-PDIP-T8
JESD-609 Code
e0
Memory Density
16384 bit
16384 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
2KX8
2KX8
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.32 mm
Serial Bus Type
I2C
I2C
Standby Current-Max
0.00005 A
Supply Current-Max
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
1
1
Part Package Code
DIP
Pin Count
8
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Length
10.03 mm
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
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Compare X24C16PMG with alternatives