WS1M32-17H2C
vs
DPS1MK32MKV3-30M
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
DPAC TECHNOLOGIES CORP
|
Part Package Code |
PGA
|
PGA
|
Package Description |
1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
PGA,
|
Pin Count |
66
|
66
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
17 ns
|
30 ns
|
Additional Feature |
USER CONFIGURABLE AS 2M X 16 OR 4M X 8
|
|
JESD-30 Code |
S-CPGA-P66
|
S-CPGA-P66
|
JESD-609 Code |
e4
|
|
Length |
35.2 mm
|
|
Memory Density |
33554432 bit
|
33554432 bit
|
Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Terminals |
66
|
66
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
1MX32
|
1MX32
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
PGA
|
PGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.7 mm
|
9.144 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
GOLD
|
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
Width |
35.2 mm
|
|
Base Number Matches |
2
|
1
|
Number of Ports |
|
1
|
Output Characteristics |
|
3-STATE
|
Output Enable |
|
YES
|
Standby Voltage-Min |
|
2 V
|
|
|
|
Compare WS1M32-17H2C with alternatives
Compare DPS1MK32MKV3-30M with alternatives