WS1M32-17H2C vs DPS1MK32MKV3-30M feature comparison

WS1M32-17H2C Microsemi Corporation

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DPS1MK32MKV3-30M B&B Electronics Manufacturing Company

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP DPAC TECHNOLOGIES CORP
Part Package Code PGA PGA
Package Description 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 PGA,
Pin Count 66 66
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 17 ns 30 ns
Additional Feature USER CONFIGURABLE AS 2M X 16 OR 4M X 8
JESD-30 Code S-CPGA-P66 S-CPGA-P66
JESD-609 Code e4
Length 35.2 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 66 66
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 1MX32 1MX32
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA PGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.7 mm 9.144 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish GOLD
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Width 35.2 mm
Base Number Matches 2 1
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES
Standby Voltage-Min 2 V

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Compare DPS1MK32MKV3-30M with alternatives