Part Details for WS1M32-17H2C by Microsemi Corporation
Overview of WS1M32-17H2C by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WS1M32-17H2C
WS1M32-17H2C CAD Models
WS1M32-17H2C Part Data Attributes
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WS1M32-17H2C
Microsemi Corporation
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Datasheet
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WS1M32-17H2C
Microsemi Corporation
SRAM Module, 1MX32, 17ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | PGA | |
| Package Description | 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | |
| Pin Count | 66 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 17 ns | |
| Additional Feature | USER CONFIGURABLE AS 2M X 16 OR 4M X 8 | |
| JESD-30 Code | S-CPGA-P66 | |
| JESD-609 Code | e4 | |
| Length | 35.2 mm | |
| Memory Density | 33554432 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 66 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX32 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.7 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | GOLD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 35.2 mm |
Alternate Parts for WS1M32-17H2C
This table gives cross-reference parts and alternative options found for WS1M32-17H2C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS1M32-17H2C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DPS1MK32MKV3-20I | SRAM Module, 1MX32, 20ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | WS1M32-17H2C vs DPS1MK32MKV3-20I |
| DPS1MK32MKV3-35M | SRAM Module, 1MX32, 35ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | WS1M32-17H2C vs DPS1MK32MKV3-35M |
| DPS1MK32MKV3-25B | SRAM Module, 1MX32, 25ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | WS1M32-17H2C vs DPS1MK32MKV3-25B |
| DPS1MK32MKV3-20M | SRAM Module, 1MX32, 20ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | WS1M32-17H2C vs DPS1MK32MKV3-20M |
| WS1M32-17H2I | SRAM Module, 1MX32, 17ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Microsemi Corporation | WS1M32-17H2C vs WS1M32-17H2I |
| WS1M32-25H2MA | SRAM Module, 1MX32, 25ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Mercury Systems Inc | WS1M32-17H2C vs WS1M32-25H2MA |
| DPS1MK32MKV3-35I | SRAM Module, 1MX32, 35ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | WS1M32-17H2C vs DPS1MK32MKV3-35I |
| DPS1MK32MKV3-35C | SRAM Module, 1MX32, 35ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | WS1M32-17H2C vs DPS1MK32MKV3-35C |
| DPS1MK32MKV3-30M | SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | WS1M32-17H2C vs DPS1MK32MKV3-30M |
| WS1M32-25H2IA | SRAM Module, 1MX32, 25ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Microsemi Corporation | WS1M32-17H2C vs WS1M32-25H2IA |