DPS1MK32MKV3-30M vs DPS1MK32MKV3-25B feature comparison

DPS1MK32MKV3-30M B&B Electronics Manufacturing Company

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DPS1MK32MKV3-25B B&B Electronics Manufacturing Company

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer DPAC TECHNOLOGIES CORP DPAC TECHNOLOGIES CORP
Part Package Code PGA PGA
Package Description PGA, PGA, PGA66,11X11
Pin Count 66 66
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 30 ns 25 ns
JESD-30 Code S-CPGA-P66 S-CPGA-P66
Memory Density 33554432 bit 33554432 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 66 66
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 1MX32 1MX32
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA PGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 9.144 mm 9.144 mm
Standby Voltage-Min 2 V 2 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Base Number Matches 1 2
Rohs Code No
Additional Feature USER CONFIGURABLE AS 4M X 8
Alternate Memory Width 16
I/O Type COMMON
JESD-609 Code e0
Package Equivalence Code PGA66,11X11
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.0144 A
Supply Current-Max 0.96 mA
Terminal Finish Tin/Lead (Sn/Pb)

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