WS1M32-17H2C
vs
DPS1MK32MKV3-20M
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
WHITE ELECTRONIC DESIGNS CORP
DPAC TECHNOLOGIES CORP
Package Description
1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
PGA, PGA66,11X11
Reach Compliance Code
unknown
unknown
Access Time-Max
17 ns
20 ns
Additional Feature
USER CONFIGURABLE AS 2M X 16 OR 4M X 8
USER CONFIGURABLE AS 4M X 8
JESD-30 Code
S-CPGA-P66
S-CPGA-P66
JESD-609 Code
e4
e0
Length
35.2 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
1MX32
1MX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.7 mm
9.144 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
GOLD
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
35.2 mm
Base Number Matches
3
2
Part Package Code
PGA
Pin Count
66
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Alternate Memory Width
16
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
PGA66,11X11
Screening Level
MIL-STD-883 Class B (Modified)
Standby Current-Max
0.0144 A
Standby Voltage-Min
2 V
Supply Current-Max
0.96 mA
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