TSB80C186EB25 vs UPD70216GF-8-3B9 feature comparison

TSB80C186EB25 Intel Corporation

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UPD70216GF-8-3B9 NEC Electronics America Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP NEC ELECTRONICS AMERICA INC
Part Package Code QFP
Package Description LFQFP, 14 X 20 MM, PLASTIC, QFP-80
Pin Count 80
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
Address Bus Width 20 20
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 50 MHz 16.13 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G80 R-PQFP-G80
Length 12 mm 20 mm
Low Power Mode YES YES
Number of DMA Channels 4
Number of External Interrupts 6 8
Number of Serial I/Os 2 1
Number of Terminals 80 80
On Chip Data RAM Width
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Seated Height-Max 1.7 mm 3 mm
Speed 25 MHz 8 MHz
Supply Current-Max 115 mA 90 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS MOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position QUAD QUAD
Width 12 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Terminal Finish TIN LEAD

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Compare UPD70216GF-8-3B9 with alternatives