TSB80C186EB25
vs
Z8S18010FSC
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
INTEL CORP
|
LITTELFUSE INC
|
Part Package Code |
QFP
|
|
Package Description |
LFQFP,
|
QFP-80
|
Pin Count |
80
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
|
Additional Feature |
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
|
ALSO OPERATES AT 3.3V SUPPLY
|
Address Bus Width |
20
|
20
|
Bit Size |
16
|
8
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
50 MHz
|
10 MHz
|
External Data Bus Width |
16
|
8
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-PQFP-G80
|
R-PQFP-G80
|
Length |
12 mm
|
20 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
|
|
Number of External Interrupts |
6
|
|
Number of Serial I/Os |
2
|
|
Number of Terminals |
80
|
80
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
QFP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
|
Seated Height-Max |
1.7 mm
|
3.1 mm
|
Speed |
25 MHz
|
10 MHz
|
Supply Current-Max |
115 mA
|
60 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
12 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
1
|
3
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
QFP80,.7X.9,32
|
Peak Reflow Temperature (Cel) |
|
240
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TSB80C186EB25 with alternatives
Compare Z8S18010FSC with alternatives