UPD70216GF-8-3B9 vs SB80L186EB-13 feature comparison

UPD70216GF-8-3B9 NEC Electronics America Inc

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SB80L186EB-13 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NEC ELECTRONICS AMERICA INC INTEL CORP
Package Description 14 X 20 MM, PLASTIC, QFP-80 LFQFP, QFP80,.55SQ,20
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 20 20
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 16.13 MHz 26 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-PQFP-G80 S-PQFP-G80
JESD-609 Code e0 e0
Length 20 mm 12 mm
Low Power Mode YES YES
Number of DMA Channels 4
Number of External Interrupts 8 6
Number of Serial I/Os 1 2
Number of Terminals 80 80
On Chip Data RAM Width
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LFQFP
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Seated Height-Max 3 mm 1.66 mm
Speed 8 MHz 13 MHz
Supply Current-Max 90 mA 73 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 2.7 V
Supply Voltage-Nom 5 V 3 V
Surface Mount YES YES
Technology MOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position QUAD QUAD
Width 14 mm 12 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 2
Part Package Code QFP
Pin Count 80
ECCN Code 3A991.A.2
Package Equivalence Code QFP80,.55SQ,20

Compare UPD70216GF-8-3B9 with alternatives

Compare SB80L186EB-13 with alternatives