TJA1029TK/20/1J
vs
TJA1041AU/V,025
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SON
Package Description
3 X 3 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, SOT782-1, MO-229, HVSON-8
DIE,
Pin Count
8
Manufacturer Package Code
SOT782-1
NAU000
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Factory Lead Time
10 Weeks
Samacsys Manufacturer
NXP
JESD-30 Code
S-PDSO-G8
R-XUUC-N14
JESD-609 Code
e4
Length
3 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
14
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
VSSOP
DIE
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
1 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Terminal Finish
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
30
Width
3 mm
Base Number Matches
1
1
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